Infineon FS03MR12A6MA1LBBPSA1

碳化硅（SiC）6 N-沟道（3 相桥）1200V（1.2kV）400A3.7 毫欧 @ 400A，15V5.55V @ 240mA

Overview

FS02CT-15 with pin details, that includes XP EMCO - FS Series, they are designed to operate with a High Voltage - Isolated Module Type, Packaging is shown on datasheet note for use in a Box, that offers Package Case features such as 8-DIP Module, it has an Operating Temperature range of -25°C ~ 75°C, as well as the Through Hole Mounting Type, the device can also be used as OTP, OVP, SCP Features. In addition, the Size Dimension is 2.25" L x 1.12" W x 0.50" H (57.2mm x 28.5mm x 12.7mm), the device is offered in ITE (Commercial) Applications, the device has a 2 of Number of Outputs, and Current Output Max is 50mA, 50mA, and the Voltage Input Min is 0.7V, and Voltage Input Max is 12V, and the Voltage Isolation is 2.5kV (2500V), and Voltage Output 1 is 100V, and the Voltage Output 2 is -100V, and Efficiency is 0.85, and the Power Watts Manufacture Series is 10W.

FS02U60TP with EDA / CAD Models The FS02U60TP is available in SOT0805 Package, is part of the IC Chips.

Features

HybridPACK™ Series
Tray Package
Silicon Carbide (SiC) Technology
1200V (1.2kV) Drain to Source Voltage (Vdss)
400A Current - Continuous Drain (Id) @ 25°C
3.7mOhm @ 400A, 15V Rds On (Max) @ Id, Vgs
5.55V @ 240mA Vgs(th) (Max) @ Id
1320nC @ 15V Gate Charge (Qg) (Max) @ Vgs
42500pF @ 600V Input Capacitance (Ciss) (Max) @ Vds
20mW Power - Max
Chassis Mount Mounting Type
Module Package / Case