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CYD36S36V18-167BGXI

Infineon CYD36S36V18-167BGXI

1M x 364 ns-40°C ~ 85°C(TA)

比较
CYD36S36V18-167BGXI
IC SRAM 36MBIT PAR 484PBGA
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¥6750.00

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The CYD36S36V18-167BBXI is IC SRAM 36MBIT 167MHZ 256FBGA, that includes Tray Packaging, they are designed to operate with a 256-LBGA Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA), that offers Interface features such as Parallel, Voltage Supply is designed to work in 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V, as well as the 256-FBGA (17x17) Supplier Device Package, the device can also be used as 36M (1M x 36) Memory Size. In addition, the Memory Type is SRAM - Dual Port, Synchronous, the device is offered in 167MHz Speed, the device has a RAM of Format Memory.

The CYD36S36V18-167BGXC is IC SRAM 36MBIT 167MHZ 484FBGA, that includes RAM Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 36M (1M x 36), that offers Memory Type features such as SRAM - Dual Port, Synchronous, it has an Operating Temperature range of 0°C ~ 70°C (TA), as well as the 484-FBGA Package Case, the device can also be used as Tray Packaging. In addition, the Speed is 167MHz, the device is offered in 484-FBGA (23x23) Supplier Device Package, the device has a 1.42 V ~ 1.58 V, 1.7 V ~ 1.9 V of Voltage Supply.

Features

Volatile Memory Type
Package / Case: 484-FBGA
484 Pins
Operating Supply Voltage:1.8V
Additional Feature:PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V
I/O Type: COMMON

Surface Mount Mounting Type

Applications


There are a lot of Cypress Semiconductor Corp
CYD36S36V18-167BGXI Memory applications.

  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
产品属性
全选
包装: 托盘
部件状态: 停产
可编程: 未验证
存储器类型: 易失
存储器格式: SRAM
技术: SRAM - 双端口,同步
存储容量: 36Mb
存储器组织: 1M x 36
存储器接口: 并联
时钟频率: 167 MHz
访问时间: 4 ns
电源电压: 1.42V ~ 1.58V,1.7V ~ 1.9V
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 484-FBGA
供应商器件封装: 484-PBGA(27x27)
Infineon Technologies

Infineon Technologies

Infineon Technologies是一家全球领先的半导体公司,成立于1999年,总部位于德国慕尼黑。公司专注于提供高性能的功率半导体、传感器和微控制器解决方案,服务于汽车、工业、电源管理和物联网等领域。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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