TI LMZ31704RVQR

非隔离 PoL 模块2.95V17V0.6 ~ 5.5V4A95%

Overview

1• Complete integrated power solution allows small footprint, low-profile design 

The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board andallows a compact point-of-load design. Achieves greater than 95% efficiency and excellent powerdissipation capability with a thermal impedance of 13.3°C/W. The LMZ31704 offers the flexibilityand the feature-set of a discrete point-of-load design and is ideal for powering a wide range ofICs and systems. Advanced packaging technology affords a robust and reliable power solutioncompatible with standard QFN mounting and testing techniques.

Features

A complete integrated power solution allows a small footprint, low-profile design

10-mm × 10-mm × 4.3-mm package

Efficiencies up to 95%

Eco-mode™ / light load efficiency (LLE)

Supports parallel operation for higher current

Optional split power rail allows input voltages down to 2.95 V

The adjustable switching frequency (200 kHz to 1.2 MHz)

Synchronizes to an external clock

Applications

Broadband and communications infrastructure

Automated test and medical equipment

Compact PCI / PCI express / PXI Express

DSP and FPGA point-of-load applications