
Microsemi APT50GN60BG
600 V107 A1185µJ(开),1565µJ(关)-55°C ~ 175°C(TJ)TO-247-3
比较






¥26.00
价格更新:一个月前博斯克质量保证







Overview
The APT50GN60BDQ2G is IGBT 600V 107A 366W TO247, that includes Tube Packaging, they are designed to operate with a 1.340411 oz Unit Weight, Mounting Style is shown on datasheet note for use in a Through Hole, that offers Package Case features such as TO-247-3, Input Type is designed to work in Standard, as well as the Through Hole Mounting Type, the device can also be used as TO-247 [B] Supplier Device Package. In addition, the Configuration is Single, the device is offered in 366W Power Max, the device has a 107A of Current Collector Ic Max, and Voltage Collector Emitter Breakdown Max is 600V, and the IGBT Type is Trench Field Stop, and Current Collector Pulsed Icm is 150A, and the Vce on Max Vge Ic is 1.85V @ 15V, 50A, and Switching Energy is 1185μJ (on), 1565μJ (off), and the Gate Charge is 325nC, and Td on off 25°C is 20ns/230ns, and the Test Condition is 400V, 50A, 4.3 Ohm, 15V, and Pd Power Dissipation is 366 W, it has an Maximum Operating Temperature range of + 175 C, it has an Minimum Operating Temperature range of - 55 C, and the Collector Emitter Voltage VCEO Max is 600 V, and Collector Emitter Saturation Voltage is 1.5 V, and the Continuous Collector Current at 25 C is 107 A, and Gate Emitter Leakage Current is 600 nA, and the Maximum Gate Emitter Voltage is 30 V, and Continuous Collector Current Ic Max is 107 A.
The APT50GN60BDQ is IGBT 600V 107A 366W TO247 manufactured by APT. The APT50GN60BDQ is available in TO-247-3 Package, is part of the IGBTs - Single, , and with support for IGBT 600V 107A 366W TO247.
Features
Tube PackageTrench Field Stop IGBT Type
600 V Voltage - Collector Emitter Breakdown (Max)
107 A Current - Collector (Ic) (Max)
150 A Current - Collector Pulsed (Icm)
1.85V @ 15V, 50A Vce(on) (Max) @ Vge, Ic
366 W Power - Max
1185µJ (on), 1565µJ (off) Switching Energy
Standard Input Type
325 nC Gate Charge
20ns/230ns Td (on/off) @ 25°C
400V, 50A, 4.3Ohm, 15V Test Condition
Through Hole Mounting Type
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Microsemi Corporation
Microsemi Corporation是一家提供高性能半导体和系统解决方案的公司,专注于通信、国防与安全、航空和工业市场。公司成立于1959年,总部位于美国加利福尼亚州阿利索维耶荷。Microsemi于2018年被Microchip Technology收购。
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