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TX253-30

TI TX253-30

CCD7.4µm x 7.4µm

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TX253-30
680X500 PIXEL IMAGE SENSOR
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价格更新:一个月前

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产品详情

Overview

The TX25-30P-LT-H1E is CONN PLUG 1.27MM 30POS GOLD R/A, that includes TX25 Series, they are designed to operate with a Tray Packaging, Mounting Type is shown on datasheet note for use in a Through Hole, Right Angle, that offers Features features such as Board Lock, Height Above Board is designed to work in 0.354" (9.00mm), as well as the Plug, Center Strip Contacts Connector Type, the device can also be used as Gold Contact Finish. In addition, the Contact Finish Thickness is 3.9μin (0.10μm), the device is offered in 30 Number of Positions, the device has a 0.050" (1.27mm) of Pitch, and Number of Rows is 2.

The TX25-30P-LT-N1E is CONN PLUG 1.27MM 30POS GOLD R/A, that includes Plug, Center Strip Contacts Connector Type, they are designed to operate with a Gold Contact Finish, Contact Finish Thickness is shown on datasheet note for use in a 3.9μin (0.10μm), that offers Height Above Board features such as 0.354" (9.00mm), Mounting Type is designed to work in Through Hole, Right Angle, as well as the 30 Number of Positions, the device can also be used as 2 Number of Rows. In addition, the Packaging is Tray, the device is offered in 0.050" (1.27mm) Pitch, the device has a TX25 of Series.

Features

Bulk Package
CCD Type
7.4µm x 7.4µm Pixel Size
656H x 496V Active Pixel Array
5.5V ~ 13V Voltage - Supply
产品属性
全选
包装: 散装
部件状态: 停产
类型: CCD
像素大小: 7.4µm x 7.4µm
有源像素矩阵: 656H x 496V
电源电压: 5.5V ~ 13V
封装/外壳: 12-DIP 模块
供应商器件封装: 12-DIP
Texas Instruments

Texas Instruments

Texas Instruments(TI)是一家全球领先的半导体公司,专注于模拟和嵌入式处理器的设计和制造。公司成立于1930年,总部位于美国德克萨斯州达拉斯。TI的产品广泛应用于工业、汽车、个人电子、通信设备和企业系统等领域,致力于通过半导体技术推动电子设备的创新和普及。

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