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TPD3S716QDBQRQ1

TI TPD3S716QDBQRQ1

18V内部开关1

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TPD3S716QDBQRQ1
IC DIODE INTERFACE PROT 16SSOP
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¥5.39

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The TPD3S716QDBQRQ1 is a single-chip solution for short-to-battery, short-circuit, and ESD protection with an adjustable current-limit for the USB connector’s VBUS and data lines in automotive applications. The integrated data switches provide best-in-class bandwidth for minimal signal degradation while simultaneously providing 18 V short-to-battery protection. The high bandwidth of 1 GHz allows for USB2.0 high-speed data rates for applications like Car Play. Extra margin in bandwidth above 720-MHz also helps to maintain a clean USB 2.0 eye diagram with the long captive cables that are common in the automotive USB environment. The short-to-battery protection isolates the internal system circuits from any over-voltage conditions at the VBUS_CON, VD+, and VD– pins. On these pins, the TPD3S716QDBQRQ1 can handle over-voltage protection up to 18 V for hot plug and DC events. The over-voltage protection circuit provides the most reliable short-to-battery isolation in the industry, shutting off the data switches in 200 ns and protecting the upstream circuitry from harmful voltage and current spikes.

The VBUS_CON pin also provides an adjustable current limited load switch and handles short-to-ground protection. The device supports VBUS currents up to 2.4 A, allowing support for charging USB BC1.2, USB Type-C 5V/1.5A, and proprietary charging schemes up to 2.4 A. The separate enable pins for data and VBUS allow for both host and client-OTG mode. TPD3S716QDBQRQ1 also integrates system level IEC 61000-4-2 and ISO 10605 ESD protection on its VBUS_CON, VD+, and VD– pins removing the need to provide external high voltage, low capacitance diodes.

Features

Tape & Reel (TR) Package
18V Voltage - Clamping
Internal Switch Technology
1 Number of Circuits
Automotive Applications
Surface Mount Mounting Type
产品属性
全选
型号系列: Automotive, AEC-Q100
包装: 卷带(TR)
部件状态: 在售
钳位电压: 18V
技术: 内部开关
电路数: 1
使用案例: 汽车级
安装类型: 表面贴装型
封装/外壳: 16-SSOP(0.154",3.90mm 宽)
供应商器件封装: 16-SSOP
Texas Instruments

Texas Instruments

Texas Instruments(TI)是一家全球领先的半导体公司,专注于模拟和嵌入式处理器的设计和制造。公司成立于1930年,总部位于美国德克萨斯州达拉斯。TI的产品广泛应用于工业、汽车、个人电子、通信设备和企业系统等领域,致力于通过半导体技术推动电子设备的创新和普及。

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