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TMS320VC5501ZAV300

TI TMS320VC5501ZAV300

定点主机接口,I²C,McBSP,UART300MHz48kB-40°C ~ 85°C(TC)

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TMS320VC5501ZAV300
FIXED-POINT DIGITAL SIGNAL PROCE
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¥132.60

价格更新:一个月前

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产品详情

Overview

The TMS320VC5501-300 (5501) fixed-point digital signal processor (DSP) is basedon the TMS320C55x DSP generation CPU processor core. The C55x DSP architecture achieves high performance and low power through increased parallelism and total focus on reduction in power dissipation. The CPU supports an internal bus structure that is composed of one program bus, three data read buses, two datawrite buses, and additional buses dedicated to peripheral and DMA activity. These buses provide the ability to perform up to three data reads and two datawrites in a single cycle. In parallel, the DMA controller can perform datatransfers independent of the CPU activity.

The 5501 is supported by the industry's award-winning eXpressDSP, CodeComposer Studio Integrated Development Environment (IDE), DSP/BIOS, Texas Instruments' algorithm standard, and the industry's largest third-party network. The Code Composer Studio× IDE features code generation tools that include a C Compiler, Visual Linker, simulator, RTDX, XDS510 emulation device drivers, and evaluation modules. The 5501 is also supported by the C55x DSP Library, which features more than 50 foundational software kernels (FIR filters, IIR filters, FFTs, and various math functions) as well as chip and board support libraries.

Features

TMS320C55x Series
Tray Package
Fixed Point Type
Host Interface, I²C, McBSP, UART Interface
300MHz Clock Rate
ROM (32kB) Non-Volatile Memory
48kB On-Chip RAM
3.30V Voltage - I/O
1.26V Voltage - Core
Surface Mount Mounting Type
产品属性
全选
型号系列: TMS320C55x
包装: 托盘
部件状态: 在售
类型: 定点
接口: 主机接口,I²C,McBSP,UART
时钟速率: 300MHz
非易失性存储器: ROM(32kB)
片载 RAM: 48kB
输入/输出电压: 3.30V
核心电压: 1.26V
工作温度: -40°C ~ 85°C(TC)
安装类型: 表面贴装型
封装/外壳: 201-LFBGA
供应商器件封装: 201-NFBGA(15x15)
Texas Instruments

Texas Instruments

Texas Instruments(TI)是一家全球领先的半导体公司,专注于模拟和嵌入式处理器的设计和制造。公司成立于1930年,总部位于美国德克萨斯州达拉斯。TI的产品广泛应用于工业、汽车、个人电子、通信设备和企业系统等领域,致力于通过半导体技术推动电子设备的创新和普及。

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