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TMS320DM355DZCE216

TI TMS320DM355DZCE216

数字媒体片内系统(DMSoC)ASP,I²C,SPI,UART,USB216MHz56kB0°C ~ 85°C(TC)

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TMS320DM355DZCE216
IC DGTL MEDIA SOC 337NFBGA
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¥122.20

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The DM355 is a highly integrated, programmable platform for digital still camera, digital photo frames, IP security cameras, 4-channel digital video recorders, video door bell application, and other low cost portable digital video applications. Designed to offer portable video designers and manufacturers the ability to produce affordable portable digital video solutions with high picture quality, the DM355 combines high performance MPEG4 HD (720p) codecs and JPEG codecs up to 50M pixels per second, high quality, and low power consumption at a very low price point. The DM355 also enables seamless interface to most additional external devices required for a complete digital camera implementation. The interface is flexible enough to support various types of CCD and CMOS sensors, signal conditioning circuits, power management, DDR/mDDR memory, SRAM, NAND, shutter, Iris and auto-focus motor controls, etc.

For software development support the DM355 has a complete set of ARM development tools which include: C compilers, assembly optimizers to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.

Features

TMS320DM3x, DaVinci™ Series
Supplied in the 337-LFBGA package
3 timers/counters

Surface Mount Mounting Type

Applications


There are a lot of Texas Instruments
TMS320DM355DZCE216 DSP applications.

  • Seismology
  • Audio
  • Sonar
  • Voice recognition
  • Financial signals
  • Other sensor array processing
  • Spectral density estimation
  • Statistical signal processing
  • Digital image processing, data compression
  • Video coding, audio coding
产品属性
全选
型号系列: TMS320DM3x, DaVinci™
包装: 管件
部件状态: 不适用于新设计
类型: 数字媒体片内系统(DMSoC)
接口: ASP,I²C,SPI,UART,USB
时钟速率: 216MHz
非易失性存储器: ROM(8kB)
片载 RAM: 56kB
输入/输出电压: 1.8V,3.3V
核心电压: 1.30V
工作温度: 0°C ~ 85°C(TC)
安装类型: 表面贴装型
封装/外壳: 337-LFBGA
供应商器件封装: 337-BGA(13x13)
Texas Instruments

Texas Instruments

Texas Instruments(TI)是一家全球领先的半导体公司,专注于模拟和嵌入式处理器的设计和制造。公司成立于1930年,总部位于美国德克萨斯州达拉斯。TI的产品广泛应用于工业、汽车、个人电子、通信设备和企业系统等领域,致力于通过半导体技术推动电子设备的创新和普及。

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