TI TMDSFSIADAPEVM

接口板

Overview

The DIP640-011BLF is CONN IC DIP SOCKET 40POS GOLD, that includes DIP, 0.6" (15.24mm) Row Spacing Type, they are designed to operate with a Tube Packaging, Termination is shown on datasheet note for use in a Solder, that offers Mounting Type features such as Through Hole, Features is designed to work in Open Frame, as well as the Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Housing Material, the device can also be used as 40 (2 x 20) Number of Positions or Pins Grid. In addition, the Pitch Mating is 0.100" (2.54mm), the device is offered in Gold Contact Finish Mating, the device has a 0.100" (2.54mm) of Pitch Post, and Contact Finish Post is Tin, and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Material Post is Brass.

DIP-8 with circuit diagram The DIP-8 is available in IC Package, is part of the IC Chips.

Features