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LM4431M3X-2.5/NOPB

TI LM4431M3X-2.5/NOPB

分流器固定0°C ~ 70°C(TA)

比较
LM4431M3X-2.5/NOPB
IC VREF SHUNT 2% SOT23-3
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¥2.37

价格更新:2025-03-17

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产品详情

Overview

The LM4431M3-2.5/NOPB is IC VREF SHUNT 2.5V SOT23-3, that includes LM4431 Series, they are designed to operate with a Digi-ReelR Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.007090 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in TO-236-3, SC-59, SOT-23-3, it has an Operating Temperature range of 0°C ~ 70°C (TA), the device can also be used as Surface Mount Mounting Type. In addition, the Output Type is Fixed, the device is offered in SOT-23-3 Supplier Device Package, the device has a ±2% of Tolerance, and Current Output is 15mA, and the Reference Type is Shunt, and Voltage Output Min Fixed is 2.5V, and the Temperature Coefficient is 30ppm/°C Typical, and Noise 10Hz to 10kHz is 35μVrms, and the Current Cathode is 100μA, it has an Maximum Operating Temperature range of + 70 C, it has an Minimum Operating Temperature range of 0 C, and Output Voltage is 2.5 V, and the Initial Accuracy is 2 %, and Series VREF Input Voltage Max is 2.5 V, and the Shunt Current Max is 15 mA.

LM4431M3-2.5(S2E) with circuit diagram manufactured by NS. The LM4431M3-2.5(S2E) is available in SOT-23 Package, is part of the IC Chips.

Features

Tape & Reel (TR) Package
Shunt Reference Type
Fixed Output Type
2.5V Voltage - Output (Min/Fixed)
15 mA Current - Output
±2% Tolerance
30ppm/°C Typical Temperature Coefficient
35µVrms Noise - 10Hz to 10kHz
100 µA Current - Cathode
0°C ~ 70°C (TA) Operating Temperature
Surface Mount Mounting Type
产品属性
全选
包装: 卷带(TR)
部件状态: 在售
参考类型: 分流器
输出类型: 固定
最低/固定输出电压: 2.5V
电流 - 输出: 15 mA
容差: ±2%
温度系数: 标准为 30ppm/°C
10Hz 至 10kHz 范围内的噪声: 35µVrms
阴极电流: 100 µA
工作温度: 0°C ~ 70°C(TA)
安装类型: 表面贴装型
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商器件封装: SOT-23-3
Texas Instruments

Texas Instruments

Texas Instruments(TI)是一家全球领先的半导体公司,专注于模拟和嵌入式处理器的设计和制造。公司成立于1930年,总部位于美国德克萨斯州达拉斯。TI的产品广泛应用于工业、汽车、个人电子、通信设备和企业系统等领域,致力于通过半导体技术推动电子设备的创新和普及。

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