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DRA821U4TGBALM

TI DRA821U4TGBALM

MCU, MPUARM® Cortex®-A72、ARM® Cortex®-R5F1.5MBDMA,PWM,WDT以太网、I²C、I³C、MCAN、MMC/SD/SDIO、SPI、UART、USB2 千兆赫,1 千兆赫

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DRA821U4TGBALM
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¥301.97

价格更新:一个月前

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产品详情

Overview

The A823K15X7RF5TAA is CAP CER 0.082UF 50V X7R AXIAL, that includes A Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a Axial, that offers Capacitance features such as 0.082μF, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Through Hole Mounting Type, the device can also be used as 50V Voltage Rated. In addition, the Size Dimension is 0.098" Dia x 0.150" L (2.50mm x 3.80mm), the device is offered in General Purpose Applications, the device has a ±10% of Tolerance, and Temperature Coefficient is X7R.

The A823K20X7RH5UAA is CAP CER 0.082UF 100V X7R AXIAL, that includes X7R Temperature Coefficient, they are designed to operate with a Through Hole Mounting Type, Packaging is shown on datasheet note for use in a Tape & Box (TB) Alternate Packaging, that offers Applications features such as General Purpose, Package Case is designed to work in Axial, as well as the A Series, it has an Operating Temperature range of -55°C ~ 125°C. In addition, the Voltage Rated is 100V, the device is offered in 0.118" Dia x 0.197" L (3.00mm x 5.00mm) Size Dimension, the device has a 0.082μF of Capacitance, and Tolerance is ±10%.

Features

Bulk Package
MCU, MPU Architecture
1.5MB RAM Size
DMA, PWM, WDT Peripherals
Ethernet, I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB Connectivity
2GHz, 1GHz Speed
产品属性
全选
包装: 散装
部件状态: 在售
系统架构: MCU, MPU
核心处理器: ARM® Cortex®-A72、ARM® Cortex®-R5F
内存大小: 1.5MB
外围设备: DMA,PWM,WDT
连接性: 以太网、I²C、I³C、MCAN、MMC/SD/SDIO、SPI、UART、USB
速度: 2 千兆赫,1 千兆赫
工作温度: -40°C ~ 125°C(TJ)
包装 / 盒: 433-BFBGA,FCBGA
供应商 设备封装: 433-FCBGA(17.2x17.2)
Texas Instruments

Texas Instruments

Texas Instruments(TI)是一家全球领先的半导体公司,专注于模拟和嵌入式处理器的设计和制造。公司成立于1930年,总部位于美国德克萨斯州达拉斯。TI的产品广泛应用于工业、汽车、个人电子、通信设备和企业系统等领域,致力于通过半导体技术推动电子设备的创新和普及。

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