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DM355SCZCEA135

TI DM355SCZCEA135

数字媒体片内系统(DMSoC)ASP,I²C,SPI,UART,USB135MHz56kB-40°C ~ 100°C(TC)

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DM355SCZCEA135
IC DGTL MEDIA PROCESSOR 337NFBGA
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价格更新:一个月前

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产品详情

Overview

The DM355SCZCE216 is IC DGTL MEDIA PROCESSOR 337NFBGA, that includes TMS320DM3x, DaVinci? Series, they are designed to operate with a Digital Media System-on-Chip (DMSoC) Type, Packaging is shown on datasheet note for use in a Tray, that offers Package Case features such as 337-LFBGA, it has an Operating Temperature range of 0°C ~ 85°C (TC), as well as the Surface Mount Mounting Type, the device can also be used as ASP, I2C, SPI, UART, USB Interface. In addition, the Supplier Device Package is 337-NFBGA (13x13), the device is offered in 216MHz Clock Rate, the device has a ROM (8 kB) of Non Volatile Memory, and On Chip RAM is 56kB, and the Voltage I O is 1.8V, 3.3V, and Voltage Core is 1.30V.

DM-350-C with circuit diagram, that includes 6000 Display Count, they are designed to operate with a 4 Display Digits, Display Type is shown on datasheet note for use in a LCD, that offers Features features such as Auto Off, Backlight, Hold, Min/Max, Function is designed to work in Voltage, Current, Resistance, Capacitance, Frequency, as well as the Continuity, Diode Test Functions Extra, the device can also be used as Auto Ranging. In addition, the Response is True RMS, the device is offered in DM Series, the device has a Handheld of Style, and Type is Digital (DMM).

Features

TMS320DM3x, DaVinci™ Series
Supplied in the 337-LFBGA package

Surface Mount Mounting Type

Applications


There are a lot of Texas Instruments
DM355SCZCEA135 DSP applications.

  • Speech processing
  • Radar
  • Seismology
  • Audio
  • Sonar
  • Voice recognition
  • Financial signals
  • Other sensor array processing
  • Spectral density estimation
  • Statistical signal processing
产品属性
全选
型号系列: TMS320DM3x, DaVinci™
包装: 托盘
部件状态: 停止提供
类型: 数字媒体片内系统(DMSoC)
接口: ASP,I²C,SPI,UART,USB
时钟速率: 135MHz
非易失性存储器: ROM(8kB)
片载 RAM: 56kB
输入/输出电压: 1.8V,3.3V
核心电压: 1.30V
工作温度: -40°C ~ 100°C(TC)
安装类型: 表面贴装型
封装/外壳: 337-LFBGA
供应商器件封装: 337-BGA(13x13)
Texas Instruments

Texas Instruments

Texas Instruments(TI)是一家全球领先的半导体公司,专注于模拟和嵌入式处理器的设计和制造。公司成立于1930年,总部位于美国德克萨斯州达拉斯。TI的产品广泛应用于工业、汽车、个人电子、通信设备和企业系统等领域,致力于通过半导体技术推动电子设备的创新和普及。

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