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CC2564BYFVR

TI CC2564BYFVR

蓝牙 v4.12.4GHz12dBm

比较
CC2564BYFVR
IC RF TXRX BLUETOOTH 54BGA
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比较

¥13.80

价格更新:一个月前

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产品详情

Overview

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

Features

Tape & Reel (TR) Package
54-BGA, DSBGA package
Surface Mount for mounting
TxRx Only
Tape & Reel (TR) is used
54 pins
Use CC2564

Surface Mount Mounting Type

Applications


There are a lot of Texas Instruments
CC2564BYFVR RF Transceiver ICs applications.

  • Internet Radio
  • Industrial Controls
  • Chemical Sensors
  • Security Systems
  • M2M Communication
  • Remote Device Management
  • Low-power IoT applications
  • LoT applications
  • Power Amplifier (PA)
  • Low Noise Amplifier (LNA)
产品属性
全选
包装: 卷带(TR)
部件状态: 在售
可编程: 未验证
类型: 仅限 TxRx
射频系列/标准: 蓝牙
协议: 蓝牙 v4.1
调制: GFSK,GMSK
频率: 2.4GHz
最大数据传输速率: 4Mbps
输出功率: 12dBm
灵敏度: -95dBm
串行接口: I²S,UART
电源电压: 2.2V ~ 4.8V
电流 - 接收: 40.5mA ~ 41.2mA
电流 - 传输: 40.5mA ~ 41.2mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装型
封装/外壳: 54-UFBGA,DSBGA
供应商器件封装: 54-DSBGA(2.93x3.27)
Texas Instruments

Texas Instruments

Texas Instruments(TI)是一家全球领先的半导体公司,专注于模拟和嵌入式处理器的设计和制造。公司成立于1930年,总部位于美国德克萨斯州达拉斯。TI的产品广泛应用于工业、汽车、个人电子、通信设备和企业系统等领域,致力于通过半导体技术推动电子设备的创新和普及。

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