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CC2560BRVMT

TI CC2560BRVMT

蓝牙 v4.12.4GHz10dBm

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CC2560BRVMT
IC RF TXRX+MCU BLE 4.1 76VFQFN
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¥41.96

价格更新:一个月前

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产品详情

Overview

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

Features

Tape & Reel (TR) Package


  • Up to +10 dBm output power and -90 dBm sensitivity

  • Comes in a small form factor, measuring only 7mm x 7mm

  • Integrated 8051 microcontroller core and on-chip memories

  • Supports multiple simultaneous connections (up to 7 active links)

  • Supports popular Bluetooth profiles such as A2DP, AVRCP, HFP, and HID.

  • Supports Bluetooth v2.1 + EDR and BLE (Bluetooth Low Energy) v4.0 specifications



Surface Mount Mounting Type

Applications


  • Wireless audio

  • Remote controls

  • Gaming peripherals

  • Home automation systems

产品属性
全选
包装: 卷带(TR)
部件状态: 在售
可编程: 未验证
类型: TxRx + MCU
射频系列/标准: 蓝牙
协议: 蓝牙 v4.1
调制: GFSK
频率: 2.4GHz
输出功率: 10dBm
灵敏度: -95dBm
串行接口: UART
电源电压: 2.2V ~ 4.8V
电流 - 接收: 13.7mA
电流 - 传输: 112.5mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装型
封装/外壳: 76-VQFN 双排裸露焊盘
供应商器件封装: 76-VQFNP-MR(8x8)
Texas Instruments

Texas Instruments

Texas Instruments(TI)是一家全球领先的半导体公司,专注于模拟和嵌入式处理器的设计和制造。公司成立于1930年,总部位于美国德克萨斯州达拉斯。TI的产品广泛应用于工业、汽车、个人电子、通信设备和企业系统等领域,致力于通过半导体技术推动电子设备的创新和普及。

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