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MKL03Z32VFK4R

NXP MKL03Z32VFK4R

ARM® Cortex®-M0+48MHz32KB(32K x 8)

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NXP USA Inc.
MKL03Z32VFK4R
IC MCU 32BIT 32KB FLASH 24QFN
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¥17.75

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

MKL03Z32VFG4 with pin details, that includes Kinetis KL03 Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 16-WFQFN Exposed Pad, it has an Operating Temperature range of -40°C ~ 105°C (TA), Supplier Device Package is designed to work in 16-QFN (3x3), as well as the 14 Number of I O, the device can also be used as 48MHz Speed. In addition, the Core Processor is ARMR CortexR-M0+, the device is offered in 2K x 8 RAM Size, the device has a FLASH of Program Memory Type, and Peripherals is Brown-out Detect/Reset, LVD, POR, PWM, WDT, and the Connectivity is I2C, SPI, UART/USART, and Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V, and the Core Size is 32-Bit, and Program Memory Size is 32KB (32K x 8), and the Data Converters is A/D 7x12b, and Oscillator Type is Internal.

MKL03Z32CAF4R with circuit diagram manufactured by NXP / Freescale. is part of the Embedded - Microcontrollers, , and with support for ARM Microcontrollers - MCU 32KBWLCSP 20, ARM? Cortex?-M0+ Kinetis KL03 Microcontroller IC 32-Bit 48MHz 32KB (32K x 8) FLASH 20-WLCSP (2x1.61), MCU 32-bit ARM Cortex M0+ RISC 32KB Flash 1.8V/2.5V/3.3V 20-Pin WLCSP T/R.

Features

Kinetis KL03 Series


  • Package: QFN

  • Package/Case: 24-VFQFN Exposed Pad

  • Device Package: 24-QFN (4x4)

  • RoHS: Lead free / RoHS Compliant



Surface Mount Mounting Type

Applications


  • Industrial

  • Automotive 

  • Communications equipment


产品属性
全选
型号系列: Kinetis KL03
包装: 卷带(TR)
部件状态: 在售
可编程: 未验证
核心处理器: ARM® Cortex®-M0+
内核规格: 32 位单核
速度: 48MHz
连接能力: I²C,SPI,UART/USART
外设: 欠压检测/复位,LVD,POR,PWM,WDT
输入/输出数量: 22
程序存储容量: 32KB(32K x 8)
程序存储器类型: 闪存
RAM 大小: 2K x 8
电源电压(Vcc/Vdd): 1.71V ~ 3.6V
数据转换器: A/D 7x12b
振荡器类型: 内部
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 24-VFQFN 裸露焊盘
供应商器件封装: 24-QFN(4x4)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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