
NXP MKL03Z16VFK4
ARM® Cortex®-M0+48MHz16KB(16K x 8)
比较






¥9.54
价格更新:一个月前博斯克质量保证







Overview
The MKL02Z8VFG4 is IC MCU 32BIT 8KB FLASH 16QFN, that includes Kinetis KL02 Series, they are designed to operate with a MCU Product, Packaging is shown on datasheet note for use in a Tray Alternate Packaging, that offers Unit Weight features such as 0.000564 oz, Mounting Style is designed to work in SMD/SMT, as well as the 16-WFQFN Exposed Pad Package Case, it has an Operating Temperature range of -40°C ~ 105°C (TA). In addition, the Supplier Device Package is 16-QFN (3x3), the device is offered in 14 Number of I O, the device has a 48MHz of Speed, and Core Processor is ARMR CortexR-M0+, and the RAM Size is 1K x 8, and Program Memory Type is FLASH, and the Peripherals is Brown-out Detect/Reset, LVD, POR, PWM, WDT, and Connectivity is I2C, SPI, UART/USART, and the Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V, and Core Size is 32-Bit, and the Program Memory Size is 8KB (8K x 8), and Data Converters is A/D 6x12b, and the Oscillator Type is Internal, it has an Maximum Operating Temperature range of + 105 C, it has an Minimum Operating Temperature range of - 40 C, and Operating Supply Voltage is 1.71 V to 3.6 V, and the Interface Type is I2C SPI UART, and Core is ARM Cortex M0+, and the Processor Series is ARM Cortex, and Data Bus Width is 32 bit, and the Maximum Clock Frequency is 48 MHz, and Number of ADC Channels is 1, and the Data RAM Size is 1 kB, and Data ROM Size is 8 kB, and the Number of Timers Counters is 2 Timer, and ADC Resolution is 12 bit, and the Data RAM Type is SRAM, and Data ROM Type is Flash.
MKL03Z16VFG4 with circuit diagram, that includes I2C, SPI, UART/USART Connectivity, they are designed to operate with a ARMR CortexR-M0+ Core Processor, Core Size is shown on datasheet note for use in a 32-Bit, that offers Data Converters features such as A/D 7x12b, Number of I O is designed to work in 14, it has an Operating Temperature range of -40°C ~ 105°C (TA), the device can also be used as Internal Oscillator Type. In addition, the Package Case is 16-WFQFN Exposed Pad, the device is offered in Tray Packaging, the device has a Brown-out Detect/Reset, LVD, POR, PWM, WDT of Peripherals, and Program Memory Size is 16KB (16K x 8), and the Program Memory Type is FLASH, and RAM Size is 2K x 8, and the Series is Kinetis KL03, and Speed is 48MHz, and the Supplier Device Package is 16-QFN (3x3), and Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V.
Features
Kinetis KL03 SeriesHuman-machine interface
General-purpose input/output up to 22
Communication interfaces
One 8-bit SPI module
One LPUART module
One I2C module supporting up to 1 Mbit/s, with double buffer
Analog Modules
12-bit SAR ADC with internal voltage reference, up to 818 ksps and 7 channels
High-speed analog comparator containing a 6-bit DAC and programmable reference input
1.2 V voltage reference (Vref)
Timers
Two 2-channel Timer/PWM modules
One low-power timer
Real time clock
Security and integrity modules
80-bit unique identification number per chip
Core
ARM? Cortex?-M0+ core up to 48 MHz
Memories
Up to 32 KB program flash memory
2 KB SRAM
8 KB ROM with build-in bootloader
16 bytes regfile
System peripherals
Nine low-power modes to provide power optimization based on application requirements
COP Software watchdog
Low-leakage wakeup unit
SWD debug interface and Micro Trace Buffer
Bit Manipulation Engine
Clocks
48 MHz high accuracy internal reference clock
8/2 MHz low power internal reference clock
32 kHz to 40 kHz crystal oscillator
1 kHz LPO clock
Operating Characteristics
Voltage range: 1.71 to 3.6 V
Flash write voltage range: 1.71 to 3.6 V
Temperature range (ambient): -40 to 105°C for QFN packages; -40 to 85°C for WLCSP packages
Applications
Light sensing & controlling devices
Temperature sensing and controlling devices
Fire detection & safety devices
Industrial instrumentation devices
Process control devices
- 起步价为$40,南非、巴西、印度、巴基斯坦、以色列等国家的价格会有所变动,详情请咨询相关客服人员。
- 包裹重量≤0.5kg的基本运费根据时区和国家而定。
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NXP USA Inc.
NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。
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实时新闻
博斯克数字
收入: 85M
2022年的收入为8500万美元,与2021年增长63%。
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博斯克服务全球105个国家的客户。
配件发货: 25M+
我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。
制造商: 950
2022年,博斯克从近950个制造商售卖了配件。
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