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MKE15Z256VLH7

NXP MKE15Z256VLH7

ARM® Cortex®-M0+72MHz256KB(256K x 8)

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NXP USA Inc.
MKE15Z256VLH7
IC MCU 32BIT 256KB FLASH 64LQFP
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¥23.00

价格更新:一个月前

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产品详情

Overview

The MKE11R600DCGFC is MOSFET CoolMOS Power Mosfet 600V 15A, that includes MKE11R600DCG Series, they are designed to operate with a Tube Packaging, Unit Weight is shown on datasheet note for use in a 0.229281 oz, that offers Mounting Style features such as Through Hole, Tradename is designed to work in COOLMOS, as well as the ISOPLUS-i4-5 Package Case, the device can also be used as SiC Technology. In addition, the Number of Channels is 1 Channel, the device is offered in Single Configuration, the device has a 1 N-Channel of Transistor Type, and Fall Time is 4 ns, and the Rise Time is 6 ns, and Vgs Gate Source Voltage is 20 V, and the Id Continuous Drain Current is 15 A, and Vds Drain Source Breakdown Voltage is 600 V, and the Vgs th Gate Source Threshold Voltage is 3 V, and Rds On Drain Source Resistance is 165 mOhns, and the Transistor Polarity is N-Channel, and Typical Turn Off Delay Time is 75 ns, and the Typical Turn On Delay Time is 12 ns, and Qg Gate Charge is 40 nC.

MKE06Z64VQH4 with EDA / CAD Models, that includes Tray Packaging, they are designed to operate with a LVD, PWM, WDT Peripherals, Series is shown on datasheet note for use in a Kinetis KE06, that offers Oscillator Type features such as Internal, Program Memory Type is designed to work in FLASH, as well as the CAN, I2C, SPI, UART/USART Connectivity, the device can also be used as ARMR CortexR-M0+ Core Processor. In addition, the Data Converters is A/D 16x12b, D/A 2x6b, the device is offered in 8K x 8 RAM Size, the device has a 64-QFP of Package Case, and Supplier Device Package is 64-LQFP (10x10), and the Program Memory Size is 64KB (64K x 8), and Number of I O is 58, and the Speed is 48MHz, it has an Operating Temperature range of -40°C ~ 105°C (TA), and the Core Size is 32-Bit, and Voltage Supply Vcc Vdd is 2.7 V ~ 5.5 V.

Features

Kinetis KE1xZ Series


  • Up to 256 KB program flash

  • Up to 32 KB SRAM

  • 32 KB FlexNVM for data flash and with EEPROM emulation

  • 2 KB FlexRAM for EEPROM emulation

  • 128 Bytes flash cache

  • Boot ROM with built in bootloader

  • Flash Access Control (FAC)

  • Cyclic Redundancy Check (CRC) generator module

  • 128-bit unique identification (ID) number

  • Internal watchdog (WDOG) with independent clock source

  • External watchdog monitor (EWM) module

  • ADC self calibration feature

  • On-chip clock loss monitoring



Surface Mount Mounting Type

Applications


  • Power Management

  • Consumer Electronics

  • Portable Devices

  • Industrial


产品属性
全选
型号系列: Kinetis KE1xZ
包装: 散装
部件状态: 在售
可编程: 未验证
核心处理器: ARM® Cortex®-M0+
内核规格: 32 位单核
速度: 72MHz
连接能力: FlexIO,I²C,SPI,UART/USART
外设: DMA,LVD,PWM,WDT
输入/输出数量: 58
程序存储容量: 256KB(256K x 8)
程序存储器类型: 闪存
EEPROM 容量: 34K x 8
RAM 大小: 32K x 8
电源电压(Vcc/Vdd): 2.7V ~ 5.5V
数据转换器: A/D 16x12b; D/A 1x8b
振荡器类型: 内部
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 64-LQFP
供应商器件封装: 64-LQFP(10x10)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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