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APTDF100H170G

Microsemi APTDF100H170G

1.7 kV120 A-40°C ~ 150°C(TJ)SP4

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APTDF100H170G
BRIDGE RECT 1P 1.7KV 120A SP4
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产品详情

Overview

The APTDF100H100G is DIODE MODULE FULL BRIDGE SP4, that includes Bulk Packaging, they are designed to operate with a SP4 Package Case, Mounting Type is shown on datasheet note for use in a Chassis Mount, that offers Supplier Device Package features such as SP4, Diode Type is designed to work in Single Phase, as well as the 1000V Voltage Peak Reverse Max, the device can also be used as 130A Current DC Forward If Max.

The APTDF100H120G is DIODE MODULE FULL BRIDGE SP4, that includes 120A Current DC Forward If Max, they are designed to operate with a Single Phase Diode Type, Mounting Type is shown on datasheet note for use in a Chassis Mount, that offers Package Case features such as SP4, Packaging is designed to work in Bulk, as well as the SP4 Supplier Device Package, the device can also be used as 1200V Voltage Peak Reverse Max.

Features

Bulk Package
4 pin count
120A forward voltage
forward voltage of 120A
SP4 package
operating at a temperature of -40°C~150°C TJ
peak reverse voltage of 250μA
a reverse voltage peak of 250μA

SP4 Supplier Device Package

Applications


There are a lot of Microsemi Corporation
APTDF100H170G applications of bridge rectifiers.

  • SCR power bridges for solid state starters
  • SCR and diode based input rectifiers
  • Crowbar systems for motor drives
  • Wind power (alternative energy) – Converters available as diodes, SCRs or IGBTs
  • Transportation – Traction rectifiers and auxiliary rectifiers
  • Inductive heating – Input rectifiers
  • Welding systems – Input rectifiers and fast recovery diodes
  • Uninterruptible power supplies – SCR transfer switches and input rectifiers
  • Electroplating systems – Input SCRs and output rectifiers
  • Aviation – Standby power distribution, resistive heating
产品属性
全选
包装: 散装
部件状态: 在售
二极管类型: Single Phase
技术: 标准
最大峰值反向电压: 1.7 kV
平均整流电流 (Io): 120 A
正向电流时的最大正向电压: 2.5 V @ 100 A
不同 Vr 时电流 - 反向泄漏: 250 µA @ 1700 V
工作温度: -40°C ~ 150°C(TJ)
安装类型: 底座安装
封装/外壳: SP4
供应商器件封装: SP4
Microsemi Corporation

Microsemi Corporation

Microsemi Corporation是一家提供高性能半导体和系统解决方案的公司,专注于通信、国防与安全、航空和工业市场。公司成立于1959年,总部位于美国加利福尼亚州阿利索维耶荷。Microsemi于2018年被Microchip Technology收购。

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