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TSPC603RVGS10LC

Microchip TSPC603RVGS10LC

PowerPC 603e233MHz-40°C ~ 110°C(TC)

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TSPC603RVGS10LC
IC MPU 603E 233MHZ 255CICBGA
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价格更新:一个月前

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产品详情

Overview

The TSPC603RVGH10LC is IC MPU 603E 233MHZ 255CBGA, that includes Tray Packaging, they are designed to operate with a 255-CBBGA Exposed Pad Package Case, it has an Operating Temperature range of -40°C ~ 110°C (TC), that offers Supplier Device Package features such as 255-HiTCE-CBGA (21x21), Voltage I O is designed to work in 3.3V, as well as the 233MHz Speed, the device can also be used as PowerPC 603e Core Processor. In addition, the Number of Cores Bus Width is 1 Core, 32-Bit, the device is offered in No Graphics Acceleration.

The TSPC603RVGH8LC is IC MPU 603E 200MHZ 255CBGA, that includes PowerPC 603e Core Processor, they are designed to operate with a No Graphics Acceleration, Number of Cores Bus Width is shown on datasheet note for use in a 1 Core, 32-Bit, it has an Operating Temperature range of -40°C ~ 110°C (TC), Package Case is designed to work in 255-CBBGA Exposed Pad, as well as the Tray Packaging, the device can also be used as 200MHz Speed. In addition, the Supplier Device Package is 255-HiTCE-CBGA (21x21), the device is offered in 3.3V Voltage I O.

Features

Tray Package
PowerPC 603e Core Processor
233MHz Speed
No Graphics Acceleration
3.3V Voltage - I/O
Surface Mount Mounting Type
产品属性
全选
包装: 托盘
部件状态: 停产
核心处理器: PowerPC 603e
每总线宽度内核数: 1 核,32 位
速度: 233MHz
图形加速: 无
输入/输出电压: 3.3V
工作温度: -40°C ~ 110°C(TC)
安装类型: 表面贴装型
包装 / 盒: 255-BCBGA 裸露焊盘
供应商 设备封装: 255-CI-CBGA (21x21)
Microchip Technology

Microchip Technology

Microchip Technology是一家全球领先的半导体供应商,成立于1989年,总部位于美国亚利桑那州钱德勒。公司专注于提供微控制器、混合信号、模拟和闪存IP解决方案,服务于广泛的嵌入式控制应用市场。

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