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MSCDC200H70AG

Microchip MSCDC200H70AG

700 V200 A-40°C ~ 175°C(TJ)模块

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MSCDC200H70AG
PM-DIODE-SIC-SBD-SP6C
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¥2616.23

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The CDC111FNRG4 is IC CLK BUFFER 1:9 500MHZ 28PLCC, that includes Fanout Buffer (Distribution) Type, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 28-LCC (J-Lead), it has an Operating Temperature range of 0°C ~ 70°C, Mounting Type is designed to work in Surface Mount, as well as the 3 V ~ 3.6 V Voltage Supply, the device can also be used as 28-PLCC (11.51x11.51) Supplier Device Package. In addition, the Input is LVPECL, the device is offered in LVPECL Output, the device has a 1 of Number of Circuits, and Ratio Input:Output is 1899/12/30 1:09:00, and the Differential Input:Output is Yes/Yes, and Frequency Max is 500MHz.

CDC1631F-E3 with EDA / CAD Models manufactured by MIC. The CDC1631F-E3 is available in QFP Package, is part of the IC Chips.

Features

Tube Package
Single Phase Diode Type
Silicon Carbide Schottky Technology
700 V Voltage - Peak Reverse (Max)
200 A Current - Average Rectified (Io)
1.8 V @ 200 A Voltage - Forward (Vf) (Max) @ If
800 µA @ 700 V Current - Reverse Leakage @ Vr
Chassis Mount Mounting Type
Module Package / Case
SP6 Supplier Device Package
产品属性
全选
包装: 管件
部件状态: 在售
二极管类型: Single Phase
技术: 碳化硅肖特基
最大峰值反向电压: 700 V
平均整流电流 (Io): 200 A
正向电流时的最大正向电压: 1.8 V @ 200 A
不同 Vr 时电流 - 反向泄漏: 800 µA @ 700 V
工作温度: -40°C ~ 175°C(TJ)
安装类型: 底座安装
封装/外壳: 模块
供应商器件封装: SP6
Microchip Technology

Microchip Technology

Microchip Technology是一家全球领先的半导体供应商,成立于1989年,总部位于美国亚利桑那州钱德勒。公司专注于提供微控制器、混合信号、模拟和闪存IP解决方案,服务于广泛的嵌入式控制应用市场。

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