Microchip LE57D121BTC

用户线路接口概念（SLIC）2 线4.75V ~ 5.25V

Overview

The innovative Le57D121 dual-channel SLIC device is designed for high-density POTS applications requiring a small-footprint, low-power SLIC device. By combining a fully featured line interface of two channels into one SLIC device, the Le57D121 device enables the design of a low-cost, high performance, and fully programmable line interface for multiple country applications worldwide, including Ground Start and metering capability. The on-chip Thermal Management (TMG) feature allows for significantly reduced power dissipation on the device. Optional dual battery operation to reduce total power consumption is also available. The device is offered in a thermally efficient, space-saving 44-pin eTQFP package. The 12 x 12 mm footprint allows designers to make a dramatic increase in the density of lines on a board. The Le57D121 device is also designed to significantly reduce the number of external components required for line card design.  Microsemi offers a range of compatible SLAC devices that perform the codec function in a line card. In particular, the Quad and Octal SLAC devices combined with the Le57D121 device provides a programmable line circuit that can be configured for varying requirements.

Features

Tray Package
Available in the 44-TQFP Exposed Pad package
Operating supply voltage of 5V
Operating supply current of 9.3mA

Surface Mount Mounting Type

Applications

There are a lot of Microchip Technology
LE57D121BTC Telecom applications.

• Digital Modems
• SONET/SDH terminal
• Add/Drop multiplexers (ADMs)
• T1/E1/J1 add/drop multiplexers (MUX)
• Channel Service Units (CSUs): T1/E1/J1
• Fractional T1/E1/J1
• BITS Timing
• Digital Access Cross-connect System (DACs)
• Digital Cross-connect Systems (DCS)
• Frame Relay Switches and Access Devices (FRADS)