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TLE9461ESV33XUMA1

Infineon TLE9461ESV33XUMA1

系统基础芯片(SBC)CAN 汽车24-TSSOP(0.154",3.90mm 宽)裸露焊盘

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TLE9461ESV33XUMA1
IC SYST BASIS CHIP TSDSO24-1
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¥76.00

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The TLE9461ES is a monolithically integrated circuit in an exposed pad PG-TSDSO-24-1 (150 mil) power package. The device is designed for various CAN automotive applications as main supply for the microcontroller and as interface for a CAN bus network. To support these applications, the System Basis Chip (SBC) provides the main functions, such as a 5 V lowdropout voltage regulator (LDO) for e.g. a microcontroller supply, another 5 V low-dropout voltage regulator with off-board protection for e.g. sensor supply, a HS-CAN transceiver supporting CAN FD for data transmission, a high voltage GPIO with embedded protective functions and a 16-bit Serial Peripheral Interface (SPI) to control and monitor the device. Also implemented are a configurable timeout / window watchdog circuit with a reset feature, one Fail Output and an undervoltage reset feature. The device offers low-power modes in order to minimize current consumption on applications that are connected permanently to the battery. A wake-up from the low-power mode is possible via a message on the buses, via the bi-level sensitive monitoring/wake-up input as well as via cyclic wake. 

Features

Tape & Reel (TR) Package
Applications : CAN Automotive
It belongs to Automotive, AEC-Q100, Lite SBC Series

Surface Mount Mounting Type

Applications


There are a lot of Infineon Technologies
TLE9461ESV33XUMA1 Specialized ICs applications.

  • PDAs and Palmtop Devices
  • MP3 Players
  • Secure Download and Boot
  • Ecosystem Control
  • Anti-cloning
  • Message Security
  • µP Switch Interfacing
  • Industrial Instruments
  • PC-Based Instruments
  • Portable Instruments
产品属性
全选
型号系列: Automotive, AEC-Q100, Lite SBC
包装: 卷带(TR)
部件状态: 在售
可编程: 未验证
类型: 系统基础芯片(SBC)
使用案例: CAN 汽车
安装类型: 表面贴装型
封装/外壳: 24-TSSOP(0.154",3.90mm 宽)裸露焊盘
供应商器件封装: PG-TSDSO-24-1
Infineon Technologies

Infineon Technologies

Infineon Technologies是一家全球领先的半导体公司,成立于1999年,总部位于德国慕尼黑。公司专注于提供高性能的功率半导体、传感器和微控制器解决方案,服务于汽车、工业、电源管理和物联网等领域。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

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配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

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