Infineon KITAURIXTC275LITETOBO1

MCU 32-位TriCore™AURIXTC275板

Overview

The CF2744-000 is HEAT SHRINK TUBING, that includes Black Color, they are designed to operate with a Polyolefin (PO) Material, Series is shown on datasheet note for use in a HRSR-FR, that offers Type features such as Tubing, Semi Rigid, Length is designed to work in 0.833' (254.00mm, 10.00"), it has an Operating Temperature range of -55°C ~ 90°C, the device can also be used as Flame Retardant Features. In addition, the Shrinkage Ratio is 5.6 to 1, the device is offered in 4.000" (101.6mm) Inner Diameter Supplied, the device has a 0.900" (22.9mm) of Inner Diameter Recovered, and Recovered Wall Thickness is 0.140" (3.56mm), and the Shrink Temperature is 90°C.

The CF2745-000 is HEAT SHRINK TUBING, that includes Tubing, Semi Rigid Type, they are designed to operate with a Polyolefin (PO) Material, Series is shown on datasheet note for use in a HRHF-FR, that offers Features features such as Flame Retardant, Color is designed to work in Black, as well as the 80°C Shrink Temperature, it has an Operating Temperature range of -55°C ~ 90°C. In addition, the Shrinkage Ratio is 5.6 to 1, the device is offered in 2.000" (50.8mm) Inner Diameter Supplied, the device has a 0.500' (152.40mm, 6.00") of Length, and Inner Diameter Recovered is 0.374" (9.5mm), and the Recovered Wall Thickness is 0.105" (2.67mm).

Features

TC2xx Series
Bulk Package
TriCore™ Core Processor
AURIX Platform
TC275 Utilized IC / Part
Fixed Mounting Type
Board(s) Contents