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K10046561-502 XF

Infineon K10046561-502 XF

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K10046561-502 XF
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Overview

The 10046971-003LF is CONN PWR CARD EDGE 70POS DL VERT, that includes Black Color, they are designed to operate with a HPCE? Series, Product is shown on datasheet note for use in a Receptacles, that offers Packaging features such as Tray, Mounting Style is designed to work in Through Hole, as well as the 7 A Current Rating, the device can also be used as Solder Termination Style. In addition, the Voltage Rating is 1 kVAC, the device is offered in Press-Fit Termination, it has an Operating Temperature range of -5°C ~ 105°C, and Mounting Type is Through Hole, and the Contact Material is Copper Alloy, and Contact Finish is Gold, and the Contact Finish Thickness is 30μin (0.76μm), and Number of Positions is 69 Position, and the Pitch is 0.100" (2.54mm), and Number of Rows is 2, and the Gender is Female, and Contact Type is Cantilever, and the Card Thickness is 0.062" (1.57mm), and Card Type is Non Specified - Dual Edge, and the Number of Positions Bay Row is 35, and Housing Material is Thermoplastic, and the Temperature Range is - 5 C to + 105 C, and Contact Plating is Gold, and the Insulation Resistance is 5000 MOhms, and Mounting Angle is Vertical, and the Contact Arrangement is Power.

10046742-31223TLF with circuit diagram, that includes 0.062" (1.57mm) Card Thickness, they are designed to operate with a PCI Express? Card Type, Color is shown on datasheet note for use in a Blue, that offers Contact Finish features such as Gold, Contact Finish Thickness is designed to work in Flash, as well as the Copper Alloy Contact Material, the device can also be used as Cantilever Contact Type. In addition, the Features is Board Lock, Card Latch, Locking Ramp, the device is offered in Female Gender, the device has a Through Hole of Mounting Type, and Number of Positions is 164, and the Number of Positions Bay Row is , and Number of Rows is 2, and the Packaging is Tray, and Pitch is 0.039" (1.00mm), and the Series is HPCE?, and Termination is Solder, Staggered.

Features

Tray Package
产品属性
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包装: 托盘
部件状态: 停产
Infineon Technologies

Infineon Technologies

Infineon Technologies是一家全球领先的半导体公司,成立于1999年,总部位于德国慕尼黑。公司专注于提供高性能的功率半导体、传感器和微控制器解决方案,服务于汽车、工业、电源管理和物联网等领域。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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