Infineon IGI60F1414A1LAUMA1

半桥（2）

Overview

The BU140Z-178-HT is CONN IC DIP SOCKET 14POS GOLD, that includes BU-178HT Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Tube, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Surface Mount Mounting Type, the device can also be used as Open Frame Features. In addition, the Housing Material is Polybutylene Terephthalate (PBT), Glass Filled, the device is offered in 14 (2 x 7) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Copper, and the Contact Finish Thickness Mating is 78.7μin (2.00μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is Flash, and Contact Material Post is Brass.

The BU-13-9 is INSULATOR FOR BU-11 SERIES WHT, that includes Test Clip, Lead, Probe Type, they are designed to operate with a Insulator, White Accessory Type, For Use With Related Products is shown on datasheet note for use in a Alligator Clips: BU-11A, BU-11C, that offers Series features such as .

Features

CoolGaN™ Series
Tape & Reel (TR) Package
Half Bridge (2) Output Configuration
General Purpose Applications
Logic, PWM Interface
Inductive, Resistive Load Type
140mOhm LS, 140mOhm HS Rds On (Typ)
Surface Mount Mounting Type