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ETT630N18P60HPSA1

Infineon ETT630N18P60HPSA1

1.8 kV628 A135°C(TJ)

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ETT630N18P60HPSA1
60 MM THYRISTOR/THYRISTOR MODULE
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¥1641.66

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

PSA151.5-7IRY with pin details, that includes Melcher PSA Series, they are designed to operate with a Non-Isolated PoL Module Type, Packaging is shown on datasheet note for use in a Bulk, that offers Package Case features such as 6-DIP Module, it has an Operating Temperature range of -25°C ~ 71°C, as well as the Through Hole Mounting Type, the device can also be used as Remote On/Off, OCP, SCP, UVLO Features. In addition, the Size Dimension is 2.76" L x 1.98" W x 0.99" H (70.2mm x 50.2mm x 25.2mm), the device is offered in ITE (Commercial) Applications, the device has a 1 of Number of Outputs, and Current Output Max is 1.5A, and the Voltage Input Min is 22V, and Voltage Input Max is 144V, and the Voltage Output 1 is 15V, and Efficiency is 0.87, and the Power Watts Manufacture Series is 23W.

The PSA1554-605Chassis-R is Rack Mount Power Supplies 19in Rack at 1U High For PSM500 PS manufactured by Phihong. is part of the AC DC Converters, , and with support for Rack Mount Power Supplies 19in Rack at 1U High For PSM500 PS.

Features

Tray Package
2 SCRs Number of SCRs, Diodes
1.8 kV Voltage - Off State
628 A Current - On State (It (AV)) (Max)
700 A Current - On State (It (RMS)) (Max)
2 V Voltage - Gate Trigger (Vgt) (Max)
250 mA Current - Gate Trigger (Igt) (Max)
16800A, 20000A Current - Non Rep. Surge 50, 60Hz (Itsm)
300 mA Current - Hold (Ih) (Max)
135°C (TJ) Operating Temperature
Chassis Mount Mounting Type
Module Package / Case
产品属性
全选
包装: 托盘
部件状态: 在售
结构: 串联 - 全部为 SCR
硅控整流器 (SCR)、二极管的数量: 2 SCRs
离态电压: 1.8 kV
电流 - 开启状态(It (AV))(最大值): 628 A
电流 - 开启状态(有效值)(最大值: 700 A
最大栅极触发电压: 2 V
电流 - 栅极触发 (Igt)(最大值): 250 mA
电流 - 非重复浪涌 50、60 赫兹(Itsm): 16800A, 20000A
电流 - 保持 (Ih)(最大值): 300 mA
工作温度: 135°C(TJ)
安装类型: 底座安装
包装 / 盒: 模块
Infineon Technologies

Infineon Technologies

Infineon Technologies是一家全球领先的半导体公司,成立于1999年,总部位于德国慕尼黑。公司专注于提供高性能的功率半导体、传感器和微控制器解决方案,服务于汽车、工业、电源管理和物联网等领域。

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