联系我们
中文
CYUSB2014-BZXI

Infineon CYUSB2014-BZXI

超高速 USB 外设控制器ARM9®外部程序存储器512K x 81.15V ~ 1.25V

比较
CYUSB2014-BZXI
IC EZ-USB BRIDGE FX3 3.0 121BGA
paypalvisamastercarddiscover
upsdhlsf
比较

¥90.90

价格更新:2025-03-27

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

CYUSB2014-BZXC with pin details, that includes EZ-USBR SD2 Series, they are designed to operate with a Tray Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.008039 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 121-TFBGA, it has an Operating Temperature range of 0°C ~ 70°C, the device can also be used as Surface Mount Mounting Type. In addition, the Applications is SD2? USB and Mass Storage Peripheral Controller, the device is offered in I2C, I2S, MMC/SD, SPI, UART, USB Interface, the device has a 1.15 V ~ 1.25 V of Voltage Supply, and Supplier Device Package is 121-FBGA (10x10), and the Number of I O is 59, and Core Processor is , and the RAM Size is 512K x 8, and Controller Series is CYUSB, it has an Maximum Operating Temperature range of + 70 C, it has an Minimum Operating Temperature range of 0 C, and the Operating Supply Voltage is 1.15 V to 3.6 V, and Interface Type is I2C I2S SPI UART.

CYUO1M16SFEU-70BVXI with circuit diagram manufactured by CYPRESS. The CYUO1M16SFEU-70BVXI is available in BGA Package, is part of the IC Chips.

Features

Tray Package
121-TFBGA package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of Cypress Semiconductor Corp
CYUSB2014-BZXI Microcontroller applications.

  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products
  • Digital cameras
产品属性
全选
型号系列: EZ-USB FX3™
包装: 托盘
部件状态: 在售
可编程: 未验证
使用案例: 超高速 USB 外设控制器
核心处理器: ARM9®
程序存储器类型: 外部程序存储器
控制器系列: CYUSB
RAM 大小: 512K x 8
接口: I²C,I²S,MMC/SD,SPI,UART,USB
输入/输出数量: 59
电源电压: 1.15V ~ 1.25V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装型
封装/外壳: 121-TFBGA
供应商器件封装: 121-FBGA(10x10)
Infineon Technologies

Infineon Technologies

Infineon Technologies是一家全球领先的半导体公司,成立于1999年,总部位于德国慕尼黑。公司专注于提供高性能的功率半导体、传感器和微控制器解决方案,服务于汽车、工业、电源管理和物联网等领域。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

所有产品零件号 0 - Z