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CYF0018V18L-133BGXI

Infineon CYF0018V18L-133BGXI

18M(512K x 36)133MHz-40°C ~ 85°C

比较
CYF0018V18L-133BGXI
IC FIFO SYNC 512KX36 209FBGA
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价格更新:一个月前

博斯克质量保证

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产品详情

Overview

The CYDMX256A16-90BVXI is IC SRAM 256KBIT 90NS 100VFBGA, that includes Tray Packaging, they are designed to operate with a 100-VFBGA Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA), that offers Interface features such as Parallel, Voltage Supply is designed to work in 1.8 V ~ 3.3 V, as well as the 100-VFBGA (6x6) Supplier Device Package, the device can also be used as 256K (16K x 16) Memory Size. In addition, the Memory Type is SRAM - Dual Port, MoBL, the device is offered in 90ns Speed, the device has a RAM of Format Memory.

CYDP-KIT-13638 with circuit diagram manufactured by Cypress. is part of the Evaluation Boards - Embedded - MCU, DSP, , and with support for Development Boards & Kits - ARM DEVELOPMENT KIT, Development Boards Kits - ARM DEVELOPMENT KIT.

Features

Tray Package
18M 512K x 36 memory size

Surface Mount Mounting Type

Applications


There are a lot of Cypress Semiconductor Corp
CYF0018V18L-133BGXI FIFOs Memory applications.

  • Telecommunication
  • Network switching/routing
  • Computer networks
  • Network bridges
  • Switches
  • Routers
  • Cameras
  • Multimedia
  • TVs
  • Computers
产品属性
全选
包装: 托盘
部件状态: 停产
可编程: 未验证
内存大小: 18M(512K x 36)
功能: 同步
数据速率: 133MHz
访问时间: 10ns
电源电压: 1.7 V ~ 1.9 V
总线接口的方向性: 单向
扩展类型: 宽
支持可编程标志: 是
重传能力: 是
FWFT 支持: 无
工作温度: -40°C ~ 85°C
安装类型: 表面贴装型
包装 / 盒: 209-BGA
供应商 设备封装: 209-FBGA(14x22)
Infineon Technologies

Infineon Technologies

Infineon Technologies是一家全球领先的半导体公司,成立于1999年,总部位于德国慕尼黑。公司专注于提供高性能的功率半导体、传感器和微控制器解决方案,服务于汽车、工业、电源管理和物联网等领域。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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