Infineon CYBT-263065-EVAL

收发器; Bluetooth® 52.4GHzCYBT-263065-02

Overview

The 26-6513-11 is CONN IC DIP SOCKET 26POS GOLD, that includes Lo-PRORfile, 513 Series, they are designed to operate with a DIP, 0.6" (15.24mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, as well as the Closed Frame Features, the device can also be used as Polyamide (PA46), Nylon 4/6, Glass Filled Housing Material. In addition, the Number of Positions or Pins Grid is 26 (2 x 13), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Gold of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Gold, and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 10μin (0.25μm), and the Contact Material Post is Brass.

The 2-66506-5 is CONN PIN 20-24AWG GOLD CRIMP, that includes Stamped Type, they are designed to operate with a Pin Pin or Socket, Plating is shown on datasheet note for use in a Gold, that offers Plating Thickness features such as Flash, Packaging is designed to work in Cut Tape (CT), as well as the Crimp Contact Termination, the device can also be used as Brass Material. In addition, the Series is AMPLIMITE HDP-20, the device is offered in 20-24 AWG Wire Gauge.

Features

AIROC™ Bluetooth® Series
Tray Package
Transceiver; Bluetooth® 5 Type
2.4GHz Frequency
Board(s) Supplied Contents