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BGS15MU14E6327XTSA1

Infineon BGS15MU14E6327XTSA1

通用表面贴装型

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BGS15MU14E6327XTSA1
BGS15MU14E6327XTSA1
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¥5.10

价格更新:一个月前

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产品详情

Overview

The BGS 12AL7-6 E6433 is IC SWITCH RF SPDT TSLP7-6, that includes Tape & Reel (TR) Alternate Packaging Packaging, they are designed to operate with a 6-XFDFN Exposed Pad Package Case, Impedance is shown on datasheet note for use in a 50 Ohm, it has an Operating Temperature range of -30°C ~ 85°C, Features is designed to work in DC Blocked, Single Line Control, as well as the 2.4 V ~ 3.6 V Voltage Supply, the device can also be used as TSLP-7 Supplier Device Package. In addition, the Circuit is SPDT, the device is offered in Reflective Topology, the device has a General Purpose of RF Type, and Frequency Lower is 30MHz, and the Frequency Upper is 3GHz, and Isolation Frequency is 25dB @ 2GHz (typ), and the Insertion Loss Frequency is 0.5dB @ 2GHz.

BGS 12SN6 E6327 with circuit diagram manufactured by Infineon. is part of the RF Switches, , and with support for RF Switch ICs CMOS SWITCH.

Features

Tape & Reel (TR) Package
General Purpose RF Type
SP5T Circuit
400MHz ~ 6GHz Frequency Range
48dB Isolation
1.05dB Insertion Loss
5.925GHz Test Frequency
50Ohm Impedance
1.65V ~ 1.95V Voltage - Supply
Surface Mount Mounting Type
产品属性
全选
包装: 卷带(TR)
部件状态: 在售
射频类型: 通用
电路: SP5T
频率范围: 400MHz ~ 6GHz
隔离: 48dB
插损: 1.05dB
测试频率: 5.925GHz
阻抗: 50 欧姆
电源电压: 1.65V ~ 1.95V
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 14-UFLGA 裸露焊盘
供应商器件封装: PG-ULGA-14-1
Infineon Technologies

Infineon Technologies

Infineon Technologies是一家全球领先的半导体公司,成立于1999年,总部位于德国慕尼黑。公司专注于提供高性能的功率半导体、传感器和微控制器解决方案,服务于汽车、工业、电源管理和物联网等领域。

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