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BGM13HBA9E6327XTSA1

Infineon BGM13HBA9E6327XTSA1

802.11a/b/g/n,蓝牙 v4.01.805GHz ~ 2.69GHz

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BGM13HBA9E6327XTSA1
RF TXRX MODULE BLUETOOTH SMD
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¥2.70

价格更新:一个月前

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产品详情

Overview

The BGM1033N7E6327XUSA1 is MODULE GPS FRONT-END TSNP-7-10, that includes BGM1033N7 Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 6-WDFN Exposed Pad, that offers Frequency features such as 1575.42MHz, Function is designed to work in GPS Front End, as well as the TSNP-7-10 Supplier Device Package, the device can also be used as GPS RF Type. In addition, the Part # Aliases is 1033N7 BGM BGM1033N7E6327XT E6327 SP000892662.

The BGM1032N7E6327XUSA1 is RF Front End RF SILICON MMIC manufactured by Infineon. The BGM1032N7E6327XUSA1 is available in PG-TSNP-7 Package, is part of the RF Front End (LNA + PA), , and with support for RF Front End RF SILICON MMIC, RF IC GPS Front End GPS 1575.42MHz TSNP-7-10, LNA RF Front End 14.8dB 2dB 6-Pin TSNP EP.

Features

Tape & Reel (TR) Package
Bluetooth RF Family/Standard
802.11a/b/g/n, Bluetooth v4.0 Protocol
16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM Modulation
1.805GHz ~ 2.69GHz Frequency
54Mbps Data Rate
SPI, USB Serial Interfaces
1.6V ~ 3.1V Voltage - Supply
Surface Mount Mounting Type
产品属性
全选
包装: 卷带(TR)
部件状态: 最后售卖
可编程: 未验证
射频系列/标准: 蓝牙
协议: 802.11a/b/g/n,蓝牙 v4.0
调制: 16QAM,64QAM,256QAM,DSSS,FHSS,OFDM
频率: 1.805GHz ~ 2.69GHz
数据速率: 54Mbps
串行接口: SPI,USB
电源电压: 1.6V ~ 3.1V
安装类型: 表面贴装型
工作温度: -40°C ~ 85°C
Infineon Technologies

Infineon Technologies

Infineon Technologies是一家全球领先的半导体公司,成立于1999年,总部位于德国慕尼黑。公司专注于提供高性能的功率半导体、传感器和微控制器解决方案,服务于汽车、工业、电源管理和物联网等领域。

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