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BGM12LBA9E6327XTSA1

Infineon BGM12LBA9E6327XTSA1

802.11a/b/g/n,蓝牙 v4.0703MHz ~ 960MHz-5dBm

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BGM12LBA9E6327XTSA1
RF TXRX MODULE BLUETOOTH SMD
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¥2.73

价格更新:一个月前

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产品详情

Overview

BGM113A256V2R with pin details, that includes Blue Gecko Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a Module, that offers Frequency features such as 2.4GHz, it has an Operating Temperature range of -40°C ~ 85°C, as well as the Surface Mount Mounting Type, the device can also be used as -93dBm Sensitivity. In addition, the Voltage Supply is 3.8V, the device is offered in 256kB Flash, 32kB RAM Memory Size, the device has a Bluetooth v4.1 of Protocol, and Data Rate is 1Mbps, and the Serial Interfaces is SPI, UART, and Power Output is 3dBm, and the Current Receiving is 8.7mA, and RF Family Standard is Bluetooth, and the Current Transmitting is 8.8mA, and Antenna Type is Integrated, Chip.

BGM121A256V2R with EDA / CAD Models manufactured by SILICON LABS. is part of the IC Chips, MODULE BT SIP MODULE WITH ANTENN, Bluetooth v4.2 (BLE) SMART SOC IoT 3.3V 56-Pin T/R.

Features

Tape & Reel (TR) Package
Bluetooth RF Family/Standard
802.11a/b/g/n, Bluetooth v4.0 Protocol
16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM Modulation
703MHz ~ 960MHz Frequency
54Mbps Data Rate
SPI, USB Serial Interfaces
1.6V ~ 3.1V Voltage - Supply
Surface Mount Mounting Type
产品属性
全选
包装: 卷带(TR)
部件状态: 最后售卖
可编程: 未验证
射频系列/标准: 蓝牙
协议: 802.11a/b/g/n,蓝牙 v4.0
调制: 16QAM,64QAM,256QAM,DSSS,FHSS,OFDM
频率: 703MHz ~ 960MHz
数据速率: 54Mbps
输出功率: -5dBm
串行接口: SPI,USB
电源电压: 1.6V ~ 3.1V
安装类型: 表面贴装型
工作温度: -40°C ~ 85°C
Infineon Technologies

Infineon Technologies

Infineon Technologies是一家全球领先的半导体公司,成立于1999年,总部位于德国慕尼黑。公司专注于提供高性能的功率半导体、传感器和微控制器解决方案,服务于汽车、工业、电源管理和物联网等领域。

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