Infineon 2DIB1410FXUMA1

容性耦合23000Vrms

Overview

The 10051922-1110ELF is CONN FPC BOTTOM 11POS 0.50MM R/A, that includes VLL Series, they are designed to operate with a Board Mount Product, Packaging is shown on datasheet note for use in a Cut Tape (CT) Alternate Packaging, that offers Current Rating features such as 500 mA, Termination Style is designed to work in SMD, as well as the 50V Voltage Rating, the device can also be used as Solder Termination, it has an Operating Temperature range of -55°C ~ 85°C, the device is offered in Surface Mount, Right Angle Mounting Type, the device has a Solder Retention, Zero Insertion Force (ZIF) of Features, and Height Above Board is 0.051" (1.30mm), and the Contact Material is Copper Alloy, and Contact Finish is Gold, and the Number of Positions is 11, and Pitch is 0.020" (0.50mm), and the Housing Material is Liquid Crystal Polymer (LCP), Glass Filled, and Flat Flex Type is FPC, and the FFC FCB Thickness is 0.30mm, and Locking Feature is Flip Lock, Backlock, and the Material Flammability Rating is UL94 V-0, and Connector Contact Type is Contacts, Bottom, and the Cable End Type is Tapered, and Actuator Material is Polyamide (PA9T), Nylon 9T, Glass Filled, and the Temperature Range is - 55 C to + 85 C, and Contact Plating is Gold, and the Insulation Resistance is 100 MOhms, and Mounting Angle is Right, and the Contact Location is Bottom Contact, and Actuation Type is ZIF.

The 10051922-1210EHLF is CONN FPC BOTTOM 12POS 0.50MM R/A, that includes ZIF Actuation Type, they are designed to operate with a Polyamide (PA9T), Nylon 9T, Glass Filled Actuator Material, Cable End Type is shown on datasheet note for use in a Tapered, that offers Connector Contact Type features such as Contacts, Bottom, Contact Finish is designed to work in Gold, as well as the Bottom Contact Contact Location, the device can also be used as Copper Alloy Contact Material. In addition, the Contact Plating is Gold, the device is offered in 500 mA Current Rating, the device has a Solder Retention, Zero Insertion Force (ZIF) of Features, and FFC FCB Thickness is 0.30mm, and the Flat Flex Type is FPC, and Height Above Board is 0.051" (1.30mm), and the Housing Material is Liquid Crystal Polymer (LCP), Glass Filled, and Insulation Resistance is 100 MOhms, and the Locking Feature is Flip Lock, Backlock, and Material Flammability Rating is UL94 V-0, and the Mounting Type is Surface Mount, Right Angle, and Mounting Angle is Right, and the Number of Positions is 12, it has an Operating Temperature range of -55°C ~ 85°C, and the Packaging is Tape & Reel (TR), and Pitch is 0.020" (0.50mm), and the Product is Board Mount, and Series is VLL, and the Temperature Range is - 55 C to + 85 C, and Termination is Solder, and the Termination Style is SMD, and Voltage Rating is 50V.

Features

Tape & Reel (TR) Package
Capacitive Coupling Technology
General Purpose Type
No Isolated Power
2 Number of Channels
1/1 Inputs - Side 1/Side 2
Unidirectional Channel Type
3000Vrms Voltage - Isolation
100kV/µs Common Mode Transient Immunity (Min)
40Mbps Data Rate
33ns, 33ns Propagation Delay tpLH / tpHL (Max)
4ns Pulse Width Distortion (Max)
4ns, 4ns (Max) Rise / Fall Time (Typ)
2.7V ~ 6.5V Voltage - Supply
Surface Mount Mounting Type