Infineon 1ED3141MU12FXUMA1

Overview

The 121-13-310-41-001000 is CONN IC DIP SOCKET 10POS GOLD, that includes 121 Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Tube, that offers Termination features such as Wire Wrap, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Through Hole Mounting Type, the device can also be used as Open Frame Features. In addition, the Housing Material is Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, the device is offered in 10 (2 x 5) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Gold, and the Contact Finish Thickness Mating is 30μin (0.76μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 10μin (0.25μm), and Contact Material Post is Brass Alloy.

The 121-13-308-41-001000 is CONN IC DIP SOCKET 8POS GOLD, that includes Gold Contact Finish Mating, they are designed to operate with a Gold Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 30μin (0.76μm), that offers Contact Finish Thickness Post features such as 10μin (0.25μm), Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Alloy Contact Material Post, the device can also be used as Open Frame Features. In addition, the Housing Material is Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, the device is offered in Through Hole Mounting Type, the device has a 8 (2 x 4) of Number of Positions or Pins Grid, it has an Operating Temperature range of -55°C ~ 125°C, and the Packaging is Tube, and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm), and Series is 121, and the Termination is Wire Wrap, and Type is DIP, 0.3" (7.62mm) Row Spacing.

Features