联系我们
中文
S9S12HZ128J3CAL

NXP S9S12HZ128J3CAL

HCS1225MHz128KB(128K x 8)

比较
NXP USA Inc.
S9S12HZ128J3CAL
IC MCU 16BIT 128KB FLASH 112LQFP
paypalvisamastercarddiscover
upsdhlsf
比较

¥157.50

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

The S9S12HY64J0VLL is IC MCU 16BIT 64KB FLASH 100LQFP, that includes HCS12 Series, they are designed to operate with a Tray Packaging, Unit Weight is shown on datasheet note for use in a 0.024170 oz, that offers Package Case features such as 100-LQFP, it has an Operating Temperature range of -40°C ~ 105°C (TA), as well as the 100-LQFP (14x14) Supplier Device Package, the device can also be used as 80 Number of I O. In addition, the Speed is 32MHz, the device is offered in 4K x 8 EEPROM Size, the device has a HCS12 of Core Processor, and RAM Size is 4K x 8, and the Program Memory Type is FLASH, and Peripherals is LCD, Motor control PWM, POR, PWM, WDT, and the Connectivity is CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI, and Voltage Supply Vcc Vdd is 4.5 V ~ 5.5 V, and the Core Size is 16-Bit, and Program Memory Size is 64KB (64K x 8), and the Data Converters is A/D 8x10b, and Oscillator Type is Internal.

S9S12HY64MLL with circuit diagram manufactured by FREESCALE. The S9S12HY64MLL is available in LQFP Package, is part of the IC Chips.

Features

HCS12 Series
112-LQFP package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
S9S12HZ128J3CAL Microcontroller applications.

  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
  • Microwave ovens
  • Home appliances
  • Home video and audio
  • Entertainment products
  • Digital cameras
产品属性
全选
型号系列: HCS12
包装: 托盘
部件状态: 不适用于新设计
可编程: 未验证
核心处理器: HCS12
内核规格: 16 位
速度: 25MHz
连接能力: CANbus,EBI/EMI,I²C,SCI,SPI
外设: LCD,电机控制 PWM,POR,PWM,WDT
输入/输出数量: 91
程序存储容量: 128KB(128K x 8)
程序存储器类型: 闪存
EEPROM 容量: 2K x 8
RAM 大小: 6K x 8
电源电压(Vcc/Vdd): 2.35V ~ 2.75V
数据转换器: A/D 16x10b
振荡器类型: 内部
工作温度: -40°C ~ 85°C(TA)
安装类型: 表面贴装型
封装/外壳: 112-LQFP
供应商器件封装: 112-LQFP(20x20)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

所有产品零件号 0 - Z