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S9S12HY32J0MLH

NXP S9S12HY32J0MLH

HCS1232MHz32KB(32K x 8)

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NXP USA Inc.
S9S12HY32J0MLH
IC MCU 16BIT 32KB FLASH 64LQFP
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¥49.80

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

S9S12HY32J0CLH with pin details, that includes HCS12 Series, they are designed to operate with a Tray Packaging, Unit Weight is shown on datasheet note for use in a 0.012224 oz, that offers Package Case features such as 64-LQFP, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the 64-LQFP (10x10) Supplier Device Package, the device can also be used as 50 Number of I O. In addition, the Speed is 32MHz, the device is offered in 4K x 8 EEPROM Size, the device has a HCS12 of Core Processor, and RAM Size is 2K x 8, and the Program Memory Type is FLASH, and Peripherals is LCD, Motor control PWM, POR, PWM, WDT, and the Connectivity is CAN, EBI/EMI, I2C, IrDA, LIN, SCI, SPI, and Voltage Supply Vcc Vdd is 4.5 V ~ 5.5 V, and the Core Size is 16-Bit, and Program Memory Size is 32KB (32K x 8), and the Data Converters is A/D 6x10b, and Oscillator Type is Internal.

S9S12HY32J0CLL with circuit diagram manufactured by NXP / Freescale. is part of the Embedded - Microcontrollers, , and with support for "16-bit Microcontrollers - MCU 16-bit MCU, * Microcontroller IC, MCU 16-bit HCS12 CISC 32KB Flash 5V Automotive 100-Pin LQFP Tray.

Features

HCS12 Series
64-LQFP package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
S9S12HY32J0MLH Microcontroller applications.

  • Automatic control
  • Equipment control
  • Instrument control
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
产品属性
全选
型号系列: HCS12
包装: 托盘
部件状态: 在售
可编程: 未验证
核心处理器: HCS12
内核规格: 16 位
速度: 32MHz
连接能力: CANbus,EBI/EMI,I²C,IrDA,LINbus,SCI,SPI
外设: LCD,电机控制 PWM,POR,PWM,WDT
输入/输出数量: 50
程序存储容量: 32KB(32K x 8)
程序存储器类型: 闪存
EEPROM 容量: 4K x 8
RAM 大小: 2K x 8
电源电压(Vcc/Vdd): 4.5V ~ 5.5V
数据转换器: A/D 6x10b
振荡器类型: 内部
工作温度: -40°C ~ 125°C(TA)
安装类型: 表面贴装型
封装/外壳: 64-LQFP
供应商器件封装: 64-LQFP(10x10)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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