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S912ZVMC25F1WKK

NXP S912ZVMC25F1WKK

S12Z50MHz256KB(256K x 8)

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NXP USA Inc.
S912ZVMC25F1WKK
IC MCU 16BIT 256KB FLASH 80TQFP
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¥1776.00

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

S912ZVMC12F1WKH with pin details, that includes S12 MagniV Series, they are designed to operate with a MCU Product, Packaging is shown on datasheet note for use in a Tray, that offers Unit Weight features such as 0.013178 oz, Package Case is designed to work in 64-LQFP Exposed Pad, it has an Operating Temperature range of -40°C ~ 150°C (TA), the device can also be used as 64-LQFP EP (10x10) Supplier Device Package. In addition, the Number of I O is , the device is offered in 40MHz Speed, the device has a 512 x 8 of EEPROM Size, and Core Processor is HCS12Z, and the RAM Size is 8K x 8, and Program Memory Type is FLASH, and the Peripherals is DMA, POR, PWM, WDT, and Connectivity is CAN, LIN, SCI, SPI, and the Voltage Supply Vcc Vdd is 4.5 V ~ 5.5 V, and Core Size is 16-Bit, and the Program Memory Size is 128KB (128K x 8), and Data Converters is A/D 9x12b, and the Oscillator Type is Internal, and Operating Supply Voltage is 12 V, and the Core is S12Z, and Processor Series is S12Z, and the Data Bus Width is 16 bit, and Supply Voltage Max is 40 V, and the Supply Voltage Min is 3.5 V.

S912ZVMC12WKH with EDA / CAD Models manufactured by FREESCALE. The S912ZVMC12WKH is available in QFP-64 Package, is part of the IC Chips.

Features

S12 MagniV Series
80-LQFP Exposed Pad package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
S912ZVMC25F1WKK Microcontroller applications.

  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
产品属性
全选
型号系列: S12 MagniV
包装: 散装
部件状态: 在售
可编程: 未验证
核心处理器: S12Z
内核规格: 16 位
速度: 50MHz
连接能力: CANbus,SCI,SPI
外设: DMA,POR,PWM,WDT
输入/输出数量: 31
程序存储容量: 256KB(256K x 8)
程序存储器类型: 闪存
EEPROM 容量: 1K x 8
RAM 大小: 32K x 8
电源电压(Vcc/Vdd): 3.5V ~ 40V
数据转换器: A/D 16x12b
振荡器类型: 内部
工作温度: -40°C ~ 150°C(TA)
安装类型: 表面贴装型
封装/外壳: 80-LQFP 裸露焊盘
供应商器件封装: 80-TQFP-EP(12x12)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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