联系我们
中文
S34ML01G200BHV000

Spansion S34ML01G200BHV000

128M x 825 ns-40°C ~ 105°C(TA)

比较
Spansion
S34ML01G200BHV000
IC FLASH 1GBIT PARALLEL 63BGA
paypalvisamastercarddiscover
upsdhlsf
比较

¥26.27

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

S34ML01G200BHI503 with pin details, that includes ML-2 Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 63-VFBGA, it has an Operating Temperature range of -40°C ~ 85°C (TA), Interface is designed to work in Parallel, as well as the 2.7 V ~ 3.6 V Voltage Supply, the device can also be used as 63-BGA (11x9) Supplier Device Package. In addition, the Memory Size is 1G (128M x 8), the device is offered in FLASH - NAND Memory Type, the device has a 25ns of Speed, and Format Memory is FLASH.

The S34ML01G200BHI900 is IC FLASH 1GBIT, that includes FLASH Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 1G (128M x 8), that offers Memory Type features such as FLASH - NAND, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the 63-VFBGA Package Case, the device can also be used as Tray Alternate Packaging Packaging. In addition, the Series is ML-2, the device is offered in 25ns Speed, the device has a 63-BGA (11x9) of Supplier Device Package, and Voltage Supply is 2.7 V ~ 3.6 V.

Features

FLASH Memory Format
Package / Case: 63-VFBGA
63 Pins

Surface Mount Mounting Type

Applications


There are a lot of Cypress Semiconductor Corp
S34ML01G200BHV000 Memory applications.

  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
产品属性
全选
型号系列: Automotive, AEC-Q100, ML-2
包装: 托盘
部件状态: 停产
可编程: 未验证
存储器类型: 非易失
存储器格式: 闪存
技术: FLASH - NAND(SLC)
存储容量: 1Gb
存储器组织: 128M x 8
存储器接口: 并联
单词、页面的写入周期时间: 25ns
访问时间: 25 ns
电源电压: 2.7V ~ 3.6V
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 63-VFBGA
供应商器件封装: 63-BGA(11x9)
Spansion

Spansion

Spansion是一家专注于嵌入式闪存解决方案的半导体公司,成立于2003年,由AMD和富士通的闪存业务合并而成。2015年,Spansion被Cypress Semiconductor收购。

实时新闻

博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

所有产品零件号 0 - Z