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MKE04Z8VWJ4

NXP MKE04Z8VWJ4

ARM® Cortex®-M0+48MHz8KB(8K x 8)

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NXP USA Inc.
MKE04Z8VWJ4
IC MCU 32BIT 8KB FLASH 20SOIC
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¥20.92

价格更新:一个月前

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产品详情

Overview

The MKE04Z8VWJ4 is a 32-bit 48MHz high-robustness Cortex-M0+ based Microcontroller Unit. The Kinetis KE04 MCU family delivers a next-generation solution with enhanced ESD/EMC performance, high-reliability device applications used in high electrical noise environments. The microcontroller unit offers a 32-bit solution featuring low power and high robustness. It provides a pin-compatibility within the Kinetis E series portfolio, as well as pin compatibility with our 8-bit S08P family.

Features

Kinetis KE04 Series


  • Operating characteristics

    Voltage range: 2.7 to 5.5 V

    Flash write voltage range: 2.7 to 5.5 V

    Temperature range (ambient): -40 to 105°C

  • Performance

    Up to 48 MHz ARM? Cortex?-M0+ core

    Single cycle 32-bit x 32-bit multiplier

    Single cycle I/O access port

  • Memories and memory interfaces

    Up to 128 KB flash

    Up to 256 B EEPROM

    Up to 4 KB RAM

  • Clocks

  • Oscillator (OSC) - loop-controlled Pierce oscillator, crystal or ceramic resonator range of 31.25 kHz to 39.0625 kHz or 4 MHz to 20 MHz

  • Internal clock source (ICS) - internal FLL with an internal or external reference, precision trimming of internal reference allowing 1% deviation across a temperature range of 0 °C to 70 °C and 1.5% deviation across a temperature range of -40 °C to 105 °C, up to 20 MHz

  • Internal 1 kHz low-power oscillator (LPO)

  • Security and integrity modules

    64-bit unique identification (ID) number per chip



Surface Mount Mounting Type

Applications


  • Automotive

  • Personal electronics

  • Communications equipment


产品属性
全选
型号系列: Kinetis KE04
包装: 管件
部件状态: 在售
可编程: 未验证
核心处理器: ARM® Cortex®-M0+
内核规格: 32 位单核
速度: 48MHz
连接能力: I²C,SPI,UART/USART
外设: LVD,PWM,WDT
输入/输出数量: 18
程序存储容量: 8KB(8K x 8)
程序存储器类型: 闪存
RAM 大小: 1K x 8
电源电压(Vcc/Vdd): 2.7V ~ 5.5V
数据转换器: A/D 10x12b; D/A 2x6b
振荡器类型: 内部
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
供应商器件封装: 20-SOIC
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

实时新闻

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收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

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博斯克服务全球105个国家的客户。

配件发货: 25M+

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制造商: 950

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