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MKE04Z64VLD4

NXP MKE04Z64VLD4

ARM® Cortex®-M0+48MHz64KB(64K x 8)

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NXP USA Inc.
MKE04Z64VLD4
IC MCU 32BIT 64KB FLASH 44LQFP
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¥18.20

价格更新:一个月前

博斯克质量保证

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产品详情

Overview

MKE04Z128VLK4 with pin details, that includes Kinetis KE04 Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 80-LQFP, it has an Operating Temperature range of -40°C ~ 105°C (TA), Supplier Device Package is designed to work in 80-LQFP (14x14), as well as the 71 Number of I O, the device can also be used as 48MHz Speed. In addition, the Core Processor is ARMR CortexR-M0+, the device is offered in 16K x 8 RAM Size, the device has a FLASH of Program Memory Type, and Peripherals is LVD, PWM, WDT, and the Connectivity is I2C, SPI, UART/USART, and Voltage Supply Vcc Vdd is 2.7 V ~ 5.5 V, and the Core Size is 32-Bit, and Program Memory Size is 128KB (128K x 8), and the Data Converters is A/D 16x12b, D/A 2x6b, and Oscillator Type is Internal.

MKE04Z128VLH4R with circuit diagram manufactured by NXP / Freescale. is part of the Embedded - Microcontrollers, , and with support for "ARM Microcontrollers - MCU Kinetis E 32-bit MCU, * Microcontroller IC, MCU 32-bit ARM Cortex M0+ CISC 128KB Flash, ARM Microcontrollers - MCU Kinetis E 32-bit MCU, ARM Cortex-M0+ core, 128KB Flash, 48MHz, 5V, QFP 64.

Features

Kinetis KE04 Series


  • With three power modes: Run, Wait, and Stop, the power management module (PMC)

  • Low-voltage detection (LVD) with adjustable trip points and a reset or interrupt function

  • Watchdog with a separate source of time (WDOG)

  • Programmable module for cyclic redundancy checks (CRC)

  • Interface for serial wire debugging (SWD)

  • SRAM bitband region with aliasing (BIT-BAND)

  • Engine for bit manipulation (BME)



Surface Mount Mounting Type

Applications


Switching applications


产品属性
全选
型号系列: Kinetis KE04
包装: 托盘
部件状态: 在售
可编程: 未验证
核心处理器: ARM® Cortex®-M0+
内核规格: 32 位单核
速度: 48MHz
连接能力: I²C,SPI,UART/USART
外设: LVD,PWM,WDT
输入/输出数量: 38
程序存储容量: 64KB(64K x 8)
程序存储器类型: 闪存
RAM 大小: 8K x 8
电源电压(Vcc/Vdd): 2.7V ~ 5.5V
数据转换器: A/D 12x12b; D/A 2x6b
振荡器类型: 内部
工作温度: -40°C ~ 105°C(TA)
安装类型: 表面贴装型
封装/外壳: 44-LQFP
供应商器件封装: 44-LQFP(10x10)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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