Microsemi SM48DB

插座模块 DIPMicrosemi FPGA

Overview

The 5-102589-5 is CONN HEADER 50POS DUAL R/A GOLD, that includes Black Color, they are designed to operate with a AMPMODU Mod II Series, Packaging is shown on datasheet note for use in a Tube, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, Right Angle, as well as the Shrouded Connector Type, the device can also be used as Gold Contact Finish. In addition, the Contact Finish Thickness is 15μin (0.38μm), the device is offered in 50 Number of Positions, the device has a All of Number of Positions Loaded, and Pitch is 0.100" (2.54mm), and the Number of Rows is 2, and Row Spacing is 0.100" (2.54mm), and the Contact Mating Length is 0.320" (8.13mm), and Molding Height Above Board is 0.320" (8.11mm).

The 5-102589-8 is CONN HEADER 12POS DUAL R/A GOLD, that includes Tube Packaging, they are designed to operate with a Through Hole, Right Angle Mounting Type, Termination is shown on datasheet note for use in a Solder, that offers Connector Type features such as Shrouded, Contact Finish is designed to work in Gold, as well as the Black Color, the device can also be used as AMPMODU Mod II Series. In addition, the Number of Positions Loaded is All, the device is offered in 2 Number of Rows, the device has a 15μin (0.38μm) of Contact Finish Thickness, and Number of Positions is 12, and the Contact Mating Length is 0.320" (8.13mm), and Molding Height Above Board is 0.320" (8.11mm), and the Pitch is 0.100" (2.54mm), and Row Spacing is 0.100" (2.54mm).

Features