Microsemi M2S150-ADV-DEV-KIT

FPGA + MCU/MPU SoCM2S150SmartFusion2 SoC FPGA Advanced PCIe Card板，电缆，电源

Overview

M2S150-1FCV484I with pin details, that includes SmartFusionR2 Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 484-BFBGA, it has an Operating Temperature range of -40°C ~ 100°C (TJ), Supplier Device Package is designed to work in 484-BGA, as well as the 166MHz Speed, the device can also be used as ARMR CortexR-M3 Core Processor. In addition, the Architecture is MCU, FPGA, the device is offered in 512KB MCU Flash, the device has a 64KB of MCU RAM, and Peripherals is DDR, PCIe, SERDES, and the Connectivity is CAN, Ethernet, I2C, SPI, UART/USART, USB, and Primary Attributes is FPGA - 150K Logic Modules.

M2S150-1FCVG484 with circuit diagram, that includes MCU, FPGA Architecture, they are designed to operate with a CAN, Ethernet, I2C, SPI, UART/USART, USB Connectivity, Core Processor is shown on datasheet note for use in a ARMR CortexR-M3, that offers MCU Flash features such as 512KB, MCU RAM is designed to work in 64KB, it has an Operating Temperature range of 0°C ~ 85°C (TJ), the device can also be used as 484-BFBGA Package Case. In addition, the Packaging is Tray, the device is offered in DDR, PCIe, SERDES Peripherals, the device has a FPGA - 150K Logic Modules of Primary Attributes, and Series is SmartFusionR2, and the Speed is 166MHz, and Supplier Device Package is 484-BGA.

Features

SmartFusion®2 Series
Box Package
FPGA + MCU/MPU SoC Type
M2S150 For Use With/Related Products
SmartFusion2 SoC FPGA Advanced PCIe Card Platform
Board(s), Cable(s), Power Supply Contents