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M1AFS600-PQG208I

Microsemi M1AFS600-PQG208I

11059295

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M1AFS600-PQG208I
IC FPGA 95 I/O 208QFP
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价格更新:一个月前

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产品详情

Overview

The Fusion mixed signal FPGA satisfies the demand from system architects for a device that simplifies design and unleashes their creativity. As the world’s first mixed signal programmable logic family, Fusion integrates mixed signal analog, flash memory, and FPGA fabric in a monolithic device. Fusion devices enable designers to quickly move from concept to completed design and then deliver feature-rich systems to market. This new technology takes advantage of the unique properties of Microsemi flash-based FPGAs, including a high-isolation, triple-well process and the ability to support high-voltage transistors to meet the demanding requirements of mixed signal system design.

Fusion mixed signal FPGAs bring the benefits of programmable logic to many application areas, including power management, smart battery charging, clock generation and management, and motor control. Until now, these applications have only been implemented with costly and space-consuming discrete analog components or mixed signal ASIC solutions. Fusion mixed signal FPGAs present new capabilities for system development by allowing designers to integrate a wide range of functionality into a single device, while at the same time offering the flexibility of upgrades late in the manufacturing process or after the device is in the field. Fusion devices provide an excellent alternative to costly and time-consuming mixed signal ASIC designs. In addition, when used in conjunction with the ARM Cortex-M1 processor, Fusion technology represents the definitive mixed signal FPGA platform.

Features

Fusion® Series
95 I/Os
Up to 110592 RAM bits
208 LABs/CLBs
13824 registers
Operating from a frequency of 1.0989GHz

Surface Mount Mounting Type

Applications


There are a lot of Microsemi Corporation
M1AFS600-PQG208I FPGAs applications.

  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
产品属性
全选
型号系列: Fusion®
包装: 托盘
部件状态: 停产
可编程: 未验证
内存总位数: 110592
输入/输出数量: 95
闸门数量: 600000
电源电压: 1.425V ~ 1.575V
安装类型: 表面贴装型
工作温度: -40°C ~ 100°C(TJ)
包装 / 盒: 208-BFQFP
供应商 设备封装: 208-PQFP(28x28)
Microsemi Corporation

Microsemi Corporation

Microsemi Corporation是一家提供高性能半导体和系统解决方案的公司,专注于通信、国防与安全、航空和工业市场。公司成立于1959年,总部位于美国加利福尼亚州阿利索维耶荷。Microsemi于2018年被Microchip Technology收购。

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博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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