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LX4510SFQ

Microsemi LX4510SFQ

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LX4510SFQ
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Overview

The 10076529-35105EHLF is CONN FFC BOTTOM 35POS 0.5MM R/A, that includes VLK Series, they are designed to operate with a Tape & Reel (TR) Packaging, Voltage Rating is shown on datasheet note for use in a 50V, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 85°C, as well as the Surface Mount, Right Angle Mounting Type, the device can also be used as Solder Retention, Zero Insertion Force (ZIF) Features. In addition, the Height Above Board is 0.051" (1.30mm), the device is offered in Copper Alloy Contact Material, the device has a Gold of Contact Finish, and Number of Positions is 35, and the Pitch is 0.020" (0.50mm), and Housing Material is Thermoplastic, and the Flat Flex Type is FFC, FPC, and FFC FCB Thickness is 0.30mm, and the Locking Feature is Flip Lock, and Material Flammability Rating is UL94 V-0, and the Connector Contact Type is Contacts, Bottom, and Cable End Type is Straight, Tapered, and the Actuator Material is Thermoplastic.

100-7651-01 with circuit diagram manufactured by SUN. The 100-7651-01 is available in BGA Package, is part of the IC Chips.

Features

Bulk Package
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包装: 散装
部件状态: 在售
Microsemi Corporation

Microsemi Corporation

Microsemi Corporation是一家提供高性能半导体和系统解决方案的公司,专注于通信、国防与安全、航空和工业市场。公司成立于1959年,总部位于美国加利福尼亚州阿利索维耶荷。Microsemi于2018年被Microchip Technology收购。

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博斯克数字

收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

国家: 105

博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

2022年,博斯克从近950个制造商售卖了配件。

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