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2N4857UB

Microsemi 2N4857UB

40 V40 Ohms3-SMD,无引线

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2N4857UB
JFET N-CH 40V
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¥630.02

价格更新:一个月前

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产品详情

Overview

The 1N483BTR is DIODE GEN PURP 80V 200MA DO35, that includes Tape & Reel (TR) Alternate Packaging Packaging, they are designed to operate with a DO-204AH, DO-35, Axial Package Case, Mounting Type is shown on datasheet note for use in a Through Hole, that offers Supplier Device Package features such as DO-35, Speed is designed to work in Small Signal =, as well as the Standard Diode Type, the device can also be used as 25nA @ 60V Current Reverse Leakage Vr. In addition, the Voltage Forward Vf Max If is 1V @ 100mA, the device is offered in 80V Voltage DC Reverse Vr Max, the device has a 200mA of Current Average Rectified Io, it has an Operating Temperature Junction range of 175°C (Max).

1N483BUR with EDA / CAD Models, that includes Surface Mount Mounting Type, they are designed to operate with a Standard Diode Type, Speed is shown on datasheet note for use in a Small Signal =, that offers Package Case features such as DO-213AA, Packaging is designed to work in Bulk, it has an Operating Temperature Junction range of -65°C ~ 175°C, the device can also be used as 50mA Current Average Rectified Io. In addition, the Current Reverse Leakage Vr is 25nA @ 225V, the device is offered in 225V Voltage DC Reverse Vr Max, the device has a 1V @ 100mA of Voltage Forward Vf Max If.

Features

Bulk Package
40 V Voltage - Breakdown (V(BR)GSS)
40 V Drain to Source Voltage (Vdss)
100 mA @ 15 V Current - Drain (Idss) @ Vds (Vgs=0)
6 V @ 500 pA Voltage - Cutoff (VGS off) @ Id
18pF @ 10V Input Capacitance (Ciss) (Max) @ Vds
40 Ohms Resistance - RDS(On)
360 mW Power - Max
Surface Mount Mounting Type
产品属性
全选
包装: 散装
部件状态: 在售
FET 类型: N 通道
击穿电压(栅极-源极-源极): 40 V
漏源电压(Vdss): 40 V
不同 Vds (Vgs=0) 时电流 - 漏极 (Idss): 100 mA @ 15 V
栅极-源极关态电压和漏极电流时的截止电压: 6 V @ 500 pA
Vds 时的最大输入电容 (Ciss): 18pF @ 10V
国内抵制: 40 Ohms
最大功率: 360 mW
工作温度: -65°C ~ 200°C(TJ)
安装类型: 表面贴装型
封装/外壳: 3-SMD,无引线
Microsemi Corporation

Microsemi Corporation

Microsemi Corporation是一家提供高性能半导体和系统解决方案的公司,专注于通信、国防与安全、航空和工业市场。公司成立于1959年,总部位于美国加利福尼亚州阿利索维耶荷。Microsemi于2018年被Microchip Technology收购。

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