NXP XPC8260VVHFBC

PowerPC G2166MHzDRAM，SDRAM10/100Mbps（3）0°C ~ 105°C（TA）

Overview

— PowerPC architecture-compliant memory management unit (MMU) — Common on-chip processor (COP) test interface — High-performance (6.6–7.65 SPEC95 benchmark at 300 MHz; 1.68 MIPs/MHz without inlining and 1.90 Dhrystones MIPS/MHz with — Supports bus snooping for data cache coherency — Floating-point unit (FPU) • Separate power supply for internal logic and for I/O • Separate PLLs for G2 core and for the CPM — G2 core and CPM can run at different frequencies for power/performance optimization — Internal core/bus clock multiplier that provides 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios — Internal CPM/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios • 64-bit data and 32-bit address 60x bus — Bus supports multiple master designs — Supports single- and four-beat burst transfers — 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller — Supports data parity or ECC and address parity • 32-bit data and 18-bit address local bus — Single-master bus, supports external slaves — Eight-beat burst transfers — 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller • 60x-to-PCI bridge (MPC8265 and MPC8266 only) — Programmable host bridge and agent — 32-bit data bus, 66 MHz, 3.3 V — Synchronous and asynchronous 60x and PCI clock modes — All internal address space available to external PCI host — DMA for memory block transfers — PCI-to-60x address remapping • System interface unit (SIU) — Clock synthesizer — Reset controller — Real-time clock (RTC) register — Periodic interrupt timer — Hardware bus monitor and software watchdog timer — IEEE Std. 1149.1™ standard JTAG test access port • Twelve-bank memory controller — Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other userdefinable peripherals — Byte write enables and selectable parity generation — PowerPC architecture-compliant memory management unit (MMU) — Common on-chip processor (COP) test interface — High-performance (6.6–7.65 SPEC95 benchmark at 300 MHz; 1.68 MIPs/MHz without inlining and 1.90 Dhrystones MIPS/MHz with — Supports bus snooping for data cache coherency — Floating-point unit (FPU) • Separate power supply for internal logic and for I/O • Separate PLLs for G2 core and for the CPM — G2 core and CPM can run at different frequencies for power/performance optimization — Internal core/bus clock multiplier that provides 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios — Internal CPM/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios • 64-bit data and 32-bit address 60x bus — Bus supports multiple master designs — Supports single- and four-beat burst transfers — 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller — Supports data parity or ECC and address parity • 32-bit data and 18-bit address local bus — Single-master bus, supports external slaves — Eight-beat burst transfers — 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller • 60x-to-PCI bridge (MPC8265 and MPC8266 only) — Programmable host bridge and agent — 32-bit data bus, 66 MHz, 3.3 V — Synchronous and asynchronous 60x and PCI clock modes — All internal address space available to external PCI host — DMA for memory block transfers — PCI-to-60x address remapping • System interface unit (SIU) — Clock synthesizer — Reset controller — Real-time clock (RTC) register — Periodic interrupt timer — Hardware bus monitor and software watchdog timer — IEEE Std. 1149.1™ standard JTAG test access port • Twelve-bank memory controller — Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other userdefinable peripherals — Byte write enables and selectable parity generation – Transparent – UART (low-speed operation) — One serial peripheral interface identical to the MPC860 SPI — One inter-integrated circuit (I2 C) controller (identical to the MPC860 I2 C controller) – Microwire compatible – Multiple-master, single-master, and slave modes — Up to eight TDM interfaces (four on the MPC8255) – Supports two groups of four TDM channels for a total of eight TDMs – 2,048 bytes of SI RAM – Bit or byte resolution – Independent transmit and receive routing, frame synchronization – Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN primary rate, Freescale interchip digital link (IDL), general circuit interface (GCI), and user-defined TDM serial interfaces — Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs, SCCs, SMCs, and serial channels — Four independent 16-bit timers that can be interconnected as two 32-bit timers Additional features of the MPC826xA family are as follows: • CPM — 32-Kbyte dual-port RAM — Additional MCC host commands — Eight transfer transmission convergence (TC) layers between the TDMs and FCC2 to support inverse multiplexing for ATM capabilities (IMA) (MPC8264 and MPC8266 only) • CPM multiplexing — FCC2 can also be connected to the TC layer. • TC layer (MPC8264 and MPC8266 only) — Each of the 8 TDM channels is routed in hardware to a TC layer block – Protocol-specific overhead bits may be discarded or routed to other controllers by the SI – Performing ATM TC layer functions (according to ITU-T I.432) – Transmit (Tx) updates - Cell HEC generation - Payload scrambling using self synchronizing scrambler (programmable by the user) - Coset generation (programmable by the user) - Cell rate by inserting idle/unassigned cells – Receive (Rx) updates - Cell delineation using bit by bit HEC checking and programmable ALPHA and DELTA parameters for the delineation state machine - Payload descrambling using self synchronizing scrambler (programmable by the user)

• Communications processor module (CPM)

Features

MPC82xx Series
PowerPC G2 Core
32-Bit Structure

Surface Mount Mounting Type

Applications

There are a lot of NXP USA Inc.
XPC8260VVHFBC Microprocessor applications.

• Toys
• Robots
• Radio
• Television
• Heater/Fan
• Calculator
• Kindle
• Christmas lights
• 3D printers
• Washing machine