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XPC823ZT66B2T

NXP XPC823ZT66B2T

PowerPC66MHzDRAM10Mbps(1)0°C ~ 95°C(TA)

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NXP USA Inc.
XPC823ZT66B2T
IC MPU MPC8XX 66MHZ 256BGA
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¥18.60

价格更新:一个月前

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产品详情

Overview

The XPC823VR81B2T is IC MPU MPC8XX 81MHZ 256BGA, that includes MPC8xx Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 256-BBGA, it has an Operating Temperature range of 0°C ~ 95°C (TA), Supplier Device Package is designed to work in 256-PBGA (23x23), as well as the 3.3V Voltage I O, the device can also be used as 81MHz Speed. In addition, the Core Processor is PowerPC, the device is offered in 1 Core, 32-Bit Number of Cores Bus Width, the device has a Communications; RISC CPM of Co Processors DSP, and RAM Controllers is DRAM, and the Graphics Acceleration is No, and Display & Interface Controllers is LCD, Video, and the Ethernet is 10 Mbps (1), and USB is USB 1.x (1).

The XPC823ZT66B2 is IC MPU MPC8XX 66MHZ 256BGA manufactured by MOT. The XPC823ZT66B2 is available in 256-BGA Package, is part of the Embedded - Microprocessors, , and with support for IC MPU MPC8XX 66MHZ 256BGA.

Features

MPC8xx Series


Embedded PowerPC Core Provides 99MIPS (Using Dhrystone 2.1) or 172K Dhrystones 2.1 at 75MHz

Advanced On-Chip Debug Mode

Data Bus Dynamic Bus Sizing for 8-,16-, and 32-Bit Buses

Completely Static Design (0–75MHz Operation)

Four Baud Rate Generators

Two Serial Communication Controllers (SCCs)

One Dedicated High-Speed Serial Channel for the Universal Serial Bus (USB)

Two Serial Management Controllers (SMCs) with Externally Accessible Pins



Surface Mount Mounting Type

Applications


Industrial 

Industrial transport (non-car & non-light truck) 

Enterprise systems 

Enterprise machine 

Personal electronics 

Tablets 


产品属性
全选
型号系列: MPC8xx
包装: 托盘
部件状态: 停产
核心处理器: PowerPC
每总线宽度内核数: 1 核,32 位
速度: 66MHz
协处理器/数字信号处理器(DSP): 通信;RISC CPM
RAM 控制器: DRAM
图形加速: 无
显示与接口控制器: LCD,视频
以太网: 10Mbps(1)
USB(通用串行总线): USB 1.x(1)
输入/输出电压: 3.3V
工作温度: 0°C ~ 95°C(TA)
安装类型: 表面贴装型
封装/外壳: 256-BGA
供应商器件封装: 256-PBGA(23x23)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

实时新闻

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收入: 85M

2022年的收入为8500万美元,与2021年增长63%。

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博斯克服务全球105个国家的客户。

配件发货: 25M+

我们在过去的五年中发货了2.5亿个配件,比前五年增长148%。

制造商: 950

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