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UJA1169ATK/3Z

NXP UJA1169ATK/3Z

系统基础芯片CAN,SPI3V ~ 28V表面贴装型

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NXP USA Inc.
UJA1169ATK/3Z
IC MINI-CAN SYSTEM BASIS CHIP
无数据表
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¥10.70

价格更新:一个月前

博斯克质量保证

912ob9001 201514001 201545001 201813485 2016esdduns
产品详情

Overview

UJA1168TK,118 with pin details, that includes Transceiver Type, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a 14-VDFN Exposed Pad, that offers Mounting Type features such as Surface Mount, Supplier Device Package is designed to work in 14-HVSON (3x4.5), as well as the CAN Protocol, the device can also be used as 2016/1/1 Number of Drivers Receivers. In addition, the Duplex is Full, the device is offered in 200mV Receiver Hysteresis.

UJA1168TK/VX/FDJ with EDA / CAD Models, that includes Transceiver Type, they are designed to operate with a Tape & Reel (TR) Packaging, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Duplex features such as Full, Protocol is designed to work in CAN, as well as the 2016/1/1 Number of Drivers Receivers, the device can also be used as 200mV Receiver Hysteresis. In addition, the Package Case is 14-VDFN Exposed Pad, the device is offered in 14-HVSON (3x4.5) Supplier Device Package.

Features

Tape & Reel (TR) Package
System Basis Chip Applications
CAN, SPI Interface
3V ~ 28V Voltage - Supply
Surface Mount Mounting Type
产品属性
全选
包装: 卷带(TR)
部件状态: 在售
使用案例: 系统基础芯片
接口: CAN,SPI
电源电压: 3V ~ 28V
封装/外壳: 20-VFDFN 裸露焊盘
供应商器件封装: 20-HVSON(3.5x5.5)
安装类型: 表面贴装型
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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