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TLVH431QDBVR,125

NXP TLVH431QDBVR,125

分流器可调式-40°C ~ 125°C(TA)

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NXP USA Inc.
TLVH431QDBVR,125
IC VREF SHUNT ADJ 1.5% 5TSOP
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¥0.64

价格更新:一个月前

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产品详情

Overview

TLVH431LIL3T with pin details, that includes Digi-ReelR Alternate Packaging Packaging, they are designed to operate with a TO-236-3, SC-59, SOT-23-3 Package Case, it has an Operating Temperature range of -40°C ~ 125°C (TA), that offers Mounting Type features such as Surface Mount, Output Type is designed to work in Adjustable, as well as the SOT-23-3 Supplier Device Package, the device can also be used as ±1.5% Tolerance. In addition, the Current Output is 60mA, the device is offered in Shunt Reference Type, the device has a 1.24V of Voltage Output Min Fixed, and Voltage Output Max is 18V, and the Temperature Coefficient is 100ppm/°C, and Noise 10Hz to 10kHz is 30mVrms, and the Current Cathode is 200μA.

The TLVH431MQDBZR,215 is IC VREF SHUNT ADJ SOT23-3, that includes 80μA Current Cathode, they are designed to operate with a 70mA Current Output, Mounting Type is shown on datasheet note for use in a Surface Mount, it has an Operating Temperature range of -40°C ~ 125°C (TA), Output Type is designed to work in Adjustable, as well as the TO-236-3, SC-59, SOT-23-3 Package Case, the device can also be used as Tape & Reel (TR) Packaging. In addition, the Reference Type is Shunt, the device is offered in SOT-23 (TO-236AB) Supplier Device Package, the device has a ±1.5% of Tolerance, and Voltage Output Max is 18V, and the Voltage Output Min Fixed is 1.24V.

Features

Tape & Reel (TR) Package
Shunt Reference Type
Adjustable Output Type
1.24V Voltage - Output (Min/Fixed)
18 V Voltage - Output (Max)
70 mA Current - Output
±1.5% Tolerance
80 µA Current - Cathode
Surface Mount Mounting Type
产品属性
全选
包装: 卷带(TR)
部件状态: 停产
参考类型: 分流器
输出类型: 可调式
最低/固定输出电压: 1.24V
最大输出电压: 18 V
电流 - 输出: 70 mA
容差: ±1.5%
阴极电流: 80 µA
工作温度: -40°C ~ 125°C(TA)
安装类型: 表面贴装型
封装/外壳: SC-74A,SOT-753
供应商器件封装: 5-TSOP
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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