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TLVH431MQDBZR,215

NXP TLVH431MQDBZR,215

分流器可调式-40°C ~ 125°C(TA)

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NXP USA Inc.
TLVH431MQDBZR,215
IC VREF SHUNT ADJ 1.5% TO236AB
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价格更新:一个月前

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Overview

TLVH431LICT with pin details, that includes Digi-ReelR Alternate Packaging Packaging, they are designed to operate with a 6-TSSOP, SC-88, SOT-363 Package Case, it has an Operating Temperature range of -40°C ~ 125°C (TA), that offers Mounting Type features such as Surface Mount, Output Type is designed to work in Adjustable, as well as the SOT-323-6L Supplier Device Package, the device can also be used as ±1.5% Tolerance. In addition, the Current Output is 60mA, the device is offered in Shunt Reference Type, the device has a 1.24V of Voltage Output Min Fixed, and Voltage Output Max is 18V, and the Temperature Coefficient is 100ppm/°C, and Noise 10Hz to 10kHz is 30mVrms, and the Current Cathode is 200μA.

TLVH431LIL5T with circuit diagram, that includes 200μA Current Cathode, they are designed to operate with a 60mA Current Output, Mounting Type is shown on datasheet note for use in a Surface Mount, that offers Noise 10Hz to 10kHz features such as 30mVrms, it has an Operating Temperature range of -40°C ~ 125°C (TA), as well as the Adjustable Output Type, the device can also be used as SC-74A, SOT-753 Package Case. In addition, the Packaging is Digi-ReelR Alternate Packaging, the device is offered in Shunt Reference Type, the device has a SOT-23-5 of Supplier Device Package, and Temperature Coefficient is 100ppm/°C, and the Tolerance is ±1.5%, and Voltage Output Max is 18V, and the Voltage Output Min Fixed is 1.24V.

Features

Tape & Reel (TR) Package
Shunt Reference Type
Adjustable Output Type
1.24V Voltage - Output (Min/Fixed)
18 V Voltage - Output (Max)
70 mA Current - Output
±1.5% Tolerance
80 µA Current - Cathode
Surface Mount Mounting Type
产品属性
全选
包装: 卷带(TR)
部件状态: 停产
参考类型: 分流器
输出类型: 可调式
最低/固定输出电压: 1.24V
最大输出电压: 18 V
电流 - 输出: 70 mA
容差: ±1.5%
阴极电流: 80 µA
工作温度: -40°C ~ 125°C(TA)
安装类型: 表面贴装型
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商器件封装: SOT-23(TO-236AB)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc.是NXP Semiconductors在美国的子公司,负责设计、研发、制造和销售半导体产品。公司在德克萨斯州奥斯汀和亚利桑那州钱德勒设有晶圆制造设施,专注于为汽车、工业和通信市场提供高性能解决方案。

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